Sweden
Board level shields
Supplier: MTC
Technology type: Metal Parts
Board level shields (BLS) are classical frame and cover solutions to shield any small pieces of Rf chipset and for a single rf module. MTC has developed the standard BLS, frameless with one cover and tiny contact spring.
With 3 different solutions on offer, a one-piece unit for soldering, one-piece with shielding clips and two-piece for soldering, MTC board level shields can help reduce or limit the effect of electromagnetic interference (EMI).
Range features
A high level overview of what this range offers
- Shielding from five sides (sixth side through printed PCB)
- Shields components or complete circuit parts
- Base material: tinned steel (SPTE), stainless steel, Ecotrio ZSNH
- Simple application in the standard SMD process
- Additional installation with absorbers possible
- One-piece shields
- Two-piece shields (frame and cover)
- SMD-compatible shielding clips and separate covers
- Additional installation with absorbers possible
- Tin plated and stainless steel options available
What's in this range?
All the variants in the range and a comparison of what they offer
|
Model |
BLS |
Benefit |
Dimensions WxLxHxThick |
|---|---|---|---|
|
One-piece for soldering |
Image
 |
|
From 13,66x12,70x2,54x0,20 to 44,37x44,37x9,75x0,20 |
|
One-piece with shielding clips |
Image
 |
|
From 13,66x12,70x2,54x0,20 to 44,37x44,37x9,75x0,20 |
|
Two-piece for soldering |
Image
 |
|
From 14,26x13,30x2,00x0,15 to 37,60x19,60x2,20x0,30-FS |
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Enquire
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Alternatively call our Sales Team.
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Within the Magnetics Products Technology Centre, we offer an array of services to help create customised solutions.
With the largest team of technical support specialists in Europe, we are at the forefront of a design led approach to delivering challenging and custom solutions for magnetic cores or components for production.
Whether your need is simple or complex, we can develop a solution to achieve your goals. With in- house experts we can design, develop and test prototypes that meet performance and environmental requirements of your application.
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