Gap fillers
- Technology
- Thermal interface materials
- Partner
- MTC
The connection between a component and its heat sink (without thermal interface material) can consist of up to 80 % air (thermal conductivity: 0,0262 W/mK). Thermally conductive pads (TCP) have been developed to fill the air gaps between both surfaces with a thermally conductive material. By the replacement of air with a highly thermally conductive material the heat transfer increases and hot components (IGBT, LED or Transformers) can be better cooled.
We offer an extensive selection of standard and custom gap fillers in various designs. Our PADs are used in a wide variety of industries including LED technology, audio and video equipment, medical devices and the automotive sector. Our gap filler thermal pads are characterised by high quality and optimal thermal conductivity and are used where the bridging of big distances and balancing of tolerances is important.
What’s in this range?
All the variants in the range and a comparison of what they offer
| Property | GAP PAD | GAP fillers | Unit of measure |
|---|---|---|---|
Thermal conductivity | 1-9 | 1.8 – 4.0 | W/m*K |
Thickness range | 0,5-10 | Min 0,1 mm with glass balls | mm |
Volume resistivity |
| 1013 | Ohm*cm |
Density | 1,6 to 3,5 | 1.8 – 3.5 | g/cm3 |
Hardness | 5 – 70 | Shore00 | |
Temperature range | -50 to 200 | -40 to 180 | Grad C |
