USI offer a wide range of miniaturised hosted and hostless IoT SiP solutions that have comprehensive design capabilities and advanced packaging solutions. Providing many advantages such as faster design cycles, simplified bill of materials (BoM) and increased performance within many different applications in multiple markets.

Key features:

• Lowest total cost solution
• No driver porting required
• Lower power consumption
• Smaller footprint

Their lower power consumption and excellent radio performance make them the best solutions for embedded 802.11 a/b/g/n dual-band Wi-Fi requirements such as industrial and wireless devices.

Deciding if your IoT solution should be hosted or hostless is down to preference. Typical IoT applications will require smaller modules, especially for battery-operated applications, where these devices would benefit from using a hostless USI solution. The hostless module’s internal MCU acts as a host with the application running from the internal memory and connecting to the MCU using an interface such as UART, SPI, I2C, 12S, ADC, PWM and GPIOs.

Another option is to use an external Host MCU, where the customer application runs on the Host MCU and communicates to the IoT module where the Wi-Fi/ Bluetooth network stack/ drivers are located. Communication between the IoT module and Host MCU can be via an interface with a AT-Command set or an application specific protocol.