Low loss dielectric materials
- Technology
- RF-microwave absorbers / dielectric
- Partner
- Laird
Dielectrics have the ability to compress waves and allow the transmission of microwave energy, useful in designing smaller circuit and lens.
The exact properties of these materials, the composition, purity, and processing conditions are critical to their performance and endurance over time. Laird has a full line of state-of-the-art, reliable dielectrics products that range from 1.05 to 30 dielectric constant in rod, sheet form or even 3D shape, rigid or moulded.
Laird Performance Materials can custom fabricate anything to your needs. What’s more, they have the modelling and testing capabilities to ensure your project is completed with ease and perfection.
The products in this range include low dielectric thermoset materials, powders, resins and adhesives, low dielectric foam products and controlled dielectric thermoset materials.
Range features
A high level overview of what this range offers
- Various form factors: compressible or rigid closed cell foam, elastomer, thermoplastic
- Adjusted to multiple dielectric constants
- Low loss tangent
- Rigid or flexible materials
- High / low t° stability
- Adhesive options available
- Light weight
- Low shrinkage
- Thermal insulation
- One part curing system
- Moisture resistant
- Very low dielectric constant
- Low outgassing
What’s in this range?
All the variants in the range and a comparison of what they offer
| Foam | Low density | Loss Tangent | Dielectric Constant | Temperaturerange |
|---|---|---|---|---|
Eccostock LoK | Rigid syntactic foam rod, bar and sheet stock | <0.004 | 1.7 | -70 to +150°C |
Eccostock Flex-LoK* | Flexible thin silicone version | 0.002 | 1.7 | -70 to +177°C |
Eccostock PP | Flexible closed cell sheet | 0.0001 | 1.03-1.06 | -80 to +85°C |
Eccostock SH | Rigid closed cell high temperature polyurethane sheets | 0.001-0.005 | 1.04-1.25 | -70 to +135°C |
Thermoset | Rigid | Loss tangent | Dielectric constant | Temperature range |
Eccostock 0005 | Crosslinked polystyrene rod and sheet | 0.0005 | 2.53 | -60 to +100°C |
Eccostock HIK | Tuneable dielectric constant stock | <0.002 | 3 to 15 | -65 to +110°C |
Eccostock HIK500F | High temperature tuneable dielectric constant stock | <0.002 | 3 to 30 | -56 to +204°C |
Compounds | Teraphtalate grade | Loss tangent | Dielectric constant | Temperature range |
Eccostock HIK powder | Reusable, free flowing filling powder series | 0.0004-0.0007 | 2.5-12 | |
Eccostock HIK cement | 2-part epoxy adhesive | 0.01 | 3 to 15 | |
Eccostock FFP | 1-part epoxy free-flowing powder, curing into lightweight foam | 0.005 | 1.25 | -60 to +175°C |
