Jasper X1 High-Power Femtosecond Laser – Up to 60 W and 200 µJ
- Technology
- Fibre lasers
- Partner
- Fluence Technology
The Jasper X1 is an advanced femtosecond laser system designed for flexible, high-precision material processing in industrial and research environments. It delivers ultrashort pulses as short as <270 fs with tunable pulse duration up to 20 ps, helping users optimise quality and throughput across different materials and applications. With up to 60 W average power and 200 µJ pulse energy, it supports high-throughput micromachining without compromising fine feature quality. Its all-fibre, SESAM-free architecture provides stable, alignment-free performance and enables virtually maintenance-free 24/7 operation. The system also features Advanced Pulse-on-Demand (APoD) technology for nanosecond-level pulse timing accuracy, supporting precise edge control and complex patterning. Built for integration, it supports horizontal or vertical mounting, multiple control interfaces, and reliable operation across metals, ceramics, glass, semiconductors, sapphire, and polymers.
The Jasper X1 femtosecond laser combines high average power, high pulse energy, and ultrashort pulse performance in a robust all-fibre platform for industrial ultrafast processing. It is engineered for demanding applications such as precision cutting, micro-drilling, surface structuring, and advanced microfabrication where minimal thermal impact, high repeatability, and flexible pulse control are essential.
With tunable pulse duration, burst capability, precise triggering, and straightforward system integration, the Jasper X1 is well suited to production lines, OEM machinery, and advanced R&D setups.
Range features
A high level overview of what this range offers
- All-fibre architecture: Stable, alignment-free design for reliable 24/7 industrial operation.
- Up to 60 W average power: Supports high-throughput processing and faster production cycles.
- Up to 200 µJ pulse energy: Delivers strong per-pulse performance for deep ablation and efficient cutting.
- Tunable pulse duration: Adjustable from <270 fs to 20 ps for process optimisation across materials and tasks.
- Excellent beam quality: M² < 1.2 enables clean, precise micro-features and consistent results.
- Advanced burst mode: Up to 80 pulses with Custom Envelope Burst capability for improved process efficiency.
- Nanosecond-precision triggering: APoD technology enables highly accurate pulse placement for fine details and edge quality.
- Integrator-friendly system design: Compact mountable laser head, rack-mounted supply, and multiple control interfaces simplify installation.
Processing flexibility Suitable for metals, semiconductors, ceramics, glass, sapphire, polymers, and composites. Pulse duration tuning helps balance precision, removal rate, and thermal impact.
Precision control Advanced Pulse-on-Demand supports external triggering up to 1 MHz with <50 ns jitter, helping synchronise pulse delivery with motion systems and scanners.
Industrial readiness Horizontal or vertical mounting, water cooling, standard single-phase power input, and USB, RS-232, TTL, and analogue interfaces support smooth OEM and factory integration.
What’s in this range?
All the variants in the range and a comparison of what they offer
| Specification | JX30-100 | JX30-200 | JX30-200P | JX60-200 | JX60-200P |
|---|---|---|---|---|---|
Central Wavelength | 1030 ± 5 nm | 1030 ± 5 nm | 1030 ± 5 nm | 1030 ± 5 nm | 1030 ± 5 nm |
Average Power | 30 W | 30 W | 30 W | 60 W | 60 W |
Max. Pulse Energy | 100 µJ | 200 µJ | 200 µJ | 200 µJ | 200 µJ |
Nominal Pulse Repetition Rate | 300 kHz | 150 kHz | 150 kHz | 300 kHz | 300 kHz |
Pulse Width | <270 fs (~240 fs typical) | <270 fs (~240 fs typical) | <270 fs (~240 fs typical) | <270 fs (~240 fs typical) | <270 fs (~240 fs typical) |
Pulse Duration Tuning Range | <270 fs – 8 ps | <270 fs – 8 ps | <270 fs – 8 ps | <270 fs – 20 ps | <270 fs – 20 ps |
Pulse Repetition Rate Range | Single-shot – 20 MHz | Single-shot – 20 MHz | Single-shot – 20 MHz | Single-shot – 20 MHz | Single-shot – 20 MHz |
Pulse-on-Demand Mode | Standard | Standard | Advanced | Standard | Advanced |
Max Ext. Trigger Rate / Jitter | 1 MHz / < 50 ns | 1 MHz / < 50 ns | 1 MHz / < 50 ns | 1 MHz / < 50 ns | 1 MHz / < 50 ns |
Max. Burst Energy | 100 µJ | 300 µJ | 300 µJ | 400 µJ | 400 µJ |
No. of Pulses in Burst | 2 – 80 | 2 – 80 | 2 – 12 | 2 – 80 | 2 – 12 |
Custom Envelope Burst (CEB) | Optional | Included | – | Included | – |
Beam Quality (M²) | < 1.2 | < 1.2 | < 1.2 | < 1.2 | < 1.2 |
Beam Circularity |
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Beam Divergence | < 1 mrad | < 1 mrad | < 1 mrad | < 1 mrad | < 1 mrad |
Beam Diameter (1/e²) | 2.5 ± 0.5 mm | 2.5 ± 0.5 mm | 2.5 ± 0.5 mm | 2.5 ± 0.5 mm | 2.5 ± 0.5 mm |
Polarisation (PER) | Vertical (> 28 dB) | Vertical (> 28 dB) | Vertical (> 28 dB) | Vertical (> 28 dB) | Vertical (> 28 dB) |
Beam Pointing Stability | < 20 µrad/°C | < 20 µrad/°C | < 20 µrad/°C | < 20 µrad/°C | < 20 µrad/°C |
Long-Term Power Stability (100 h) | < 0.5% | < 0.5% | < 0.5% | < 0.5% | < 0.5% |
Pulse Energy Stability (24 h) | < 1% | < 1% | < 1% | < 1% | < 1% |
Triggering | External / Internal | External / Internal | External / Internal | External / Internal | External / Internal |
Pulse Control | Internal or external analog modulation; Pulse picker; Burst mode; CEB | Internal or external analog modulation; Pulse picker; Burst mode; CEB | Internal or external analog modulation; Pulse picker; Burst mode; CEB | Internal or external analog modulation; Pulse picker; Burst mode; CEB | Internal or external analog modulation; Pulse picker; Burst mode; CEB |
Available Options | Harmonic module (515 nm, 343 nm, 257 nm); Mechanical shutter | Harmonic module (515 nm, 343 nm, 257 nm); Mechanical shutter | Harmonic module (515 nm, 343 nm, 257 nm); Mechanical shutter | Harmonic module (515 nm, 343 nm, 257 nm); Mechanical shutter | Harmonic module (515 nm, 343 nm, 257 nm); Mechanical shutter |
Cooling | Water | Water | Water | Water | Water |
Control Interface | GUI (USB); SCPI (RS-232); TTL (BNC); Analog (BNC) | GUI (USB); SCPI (RS-232); TTL (BNC); Analog (BNC) | GUI (USB); SCPI (RS-232); TTL (BNC); Analog (BNC) | GUI (USB); SCPI (RS-232); TTL (BNC); Analog (BNC) | GUI (USB); SCPI (RS-232); TTL (BNC); Analog (BNC) |
Laser Head Dimensions (L×W×H) | 1096 × 446 × 100 mm | 1096 × 446 × 100 mm | 1096 × 446 × 100 mm | 1096 × 446 × 100 mm | 1096 × 446 × 100 mm |
Laser Head Weight | 50 kg | 50 kg | 50 kg | 50 kg | 50 kg |
Power Supply Size (L×W×H) | 3U 19″ rack (376 × 485 × 133 mm) | 3U 19″ rack | 3U 19″ rack | 3U 19″ rack | 3U 19″ rack |
Power Supply Weight | 13 kg | 13 kg | 13 kg | 13 kg | 13 kg |
Mounting Orientation | Horizontal or Vertical | Horizontal or Vertical | Horizontal or Vertical | Horizontal or Vertical | Horizontal or Vertical |
Operating Temperature | 15 – 30 °C | 15 – 30 °C | 15 – 30 °C | 15 – 30 °C | 15 – 30 °C |
Relative Humidity | 10 – 80% (non-condensing) | 10 – 80% | 10 – 80% | 10 – 80% | 10 – 80% |
Power Consumption | < 620 W | < 620 W | < 620 W | < 620 W | < 620 W |
Umbilical | 3 m, detachable (longer on request) | 3 m | 3 m | 3 m | 3 m |
Electrical Supply | 100–240 VAC, 50–60 Hz (single phase) | 100–240 VAC, 50–60 Hz (single phase) | 100–240 VAC, 50–60 Hz (single phase) | 100–240 VAC, 50–60 Hz (single phase) | 100–240 VAC, 50–60 Hz (single phase) |
Key performance highlights
- Up to 60 W average power
- Up to 200 µJ pulse energy
- Pulse duration tunable from <270 fs to 20 ps
- Repetition rate from single-shot to 20 MHz
- Burst mode with up to 80 pulses
Integration and operation
- Water-cooled system
- Laser head mounting: horizontal or vertical
- Interfaces: USB, RS-232, TTL, analog
- Electrical supply: 100–240 VAC, 50–60 Hz
- Operating temperature: 15 – 30 °C
FAQs
for Jasper X1 High-Power Femtosecond Laser – Up to 60 W and 200 µJ
The Jasper X1 can process a broad range of solid materials with minimal thermal damage thanks to its ultrashort pulse duration. Suitable materials include metals such as steel, titanium, and alloys, semiconductors such as silicon and GaAs, ceramics, glass, sapphire, and many polymers and composites. This makes it suitable for microelectronics, photonics, medical device manufacturing, and advanced materials research.
Its all-fibre, SESAM-free design removes the need for free-space optical realignment and reduces long-term drift. Because key components are fibre-coupled, the system is inherently stable and well suited to continuous operation. Combined with robust industrial construction, this enables reliable 24/7 use with very low maintenance demand and excellent long-term output stability.
Advanced Pulse-on-Demand allows the laser to emit pulses exactly when triggered, with external trigger rates up to 1 MHz and timing jitter below 50 ns. This improves synchronisation with motion systems and scanners, enabling more accurate pulse placement, cleaner corners, better edge definition, and improved performance in true pulse-on-position applications.
Custom Envelope Burst (CEB) allows the Jasper X1 to emit bursts of multiple pulses with a tailored energy envelope. This helps users optimise how energy is deposited into the workpiece, which can improve machining quality, throughput, and control in demanding processes such as drilling, cutting, and high-aspect-ratio micro-feature fabrication.
Yes. The Jasper X1 is designed for integration with a compact laser head that supports horizontal or vertical mounting, a detachable 3 m umbilical, and a 19-inch rack-mount power supply. It also offers multiple control interfaces including USB GUI, RS-232/SCPI, TTL, and analogue inputs, making it straightforward to deploy in automated production lines, OEM systems, and research platforms.
Adjustable pulse duration from <270 fs up to 20 ps gives users more control over laser-material interaction. Shorter femtosecond pulses support the highest precision and lowest thermal impact, while longer picosecond settings can improve efficiency or material response in some applications. This flexibility helps engineers balance precision, throughput, and process quality using one platform.
Yes. The Jasper X1 operates at 1030 nm and can be paired with an optional harmonic module to generate 515 nm, 343 nm, and 257 nm output. This extends the laser’s usefulness for applications that benefit from green, UV, or deep-UV processing.
Typical applications include micromachining, microvia drilling, precision cutting, brittle material dicing, medical stent cutting, microfluidic fabrication, surface texturing, and fine marking. Its combination of high power, ultrashort pulses, precise triggering, and broad material compatibility makes it valuable in microelectronics, medical devices, photonics, industrial manufacturing, and research.
