Front-End Modules (FEM´s) for wireless applications
Combining industry leading Power Amplifiers (Pas), Low-Noise Amplifiers (LNAs) and switch functions into a single, laminate-based, multi-chip module.
Manufactured using their proprietary heterojunction bipolar transistor (HBT) power amplifier process and low-loss pseudomorphic high-electron mobility transistor (pHEMT) switch technologies, these FEMs will deliver superior performance to multiple applications, including automotive, smart home, industrial, M2M, medical, smart energy and wearables.
A single front-end module can efficiently increase the total performance of your wireless design, enabling you to reduce power consumption, increase efficiency or further the range of your design – from major chip manufacturers with a range of integrated FEMs to help you get the most from your design.
Enhance your wireless standards with a single easy-to-integrate, cost-effective, compact component by boosting the performance of your chosen SoC for a better user experience.
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