MDBT53 Series, Bluetooth 5.4, LGA module; nRF5340 based
- Technology
- Bluetooth modules
- Partner
- Raytac
The MDBT53-1M Bluetooth 5.2 module is designed for engineers who need reliable, low-power wireless connectivity in a compact footprint. Based on a dual-core nRF5340 device with Cortex-M33 application and network cores, it delivers both real-time radio control and powerful application processing on a single module.
With integrated flash and RAM on each core, plus a chip antenna and 48 GPIOs, it provides a flexible platform for connected products without the complexity of RF design. The module supports Bluetooth Low Energy, Bluetooth mesh, Bluetooth Direction Finding, Bluetooth low energy audio, ANT+, Zigbee and Thread over IEEE 802.15.4, making it suitable for many protocol stacks and ecosystems.
Its wide operating temperature range from -40 to +105 °C suits harsh industrial and automotive-adjacent environments. Multiple serial, audio and analogue interfaces – including SPI, QSPI, UART, I²C, I²S, PWM, ADC, NFC and USB – make it easy to attach sensors, actuators and host processors. The MDBT53-1M integrates the RF front end, chip antenna and regulatory approvals to shorten development time and simplify global certification for production designs.
Range features
A high level overview of what this range offers
-
Dual-core Bluetooth 5.2 multiprotocol module – Combines a powerful dual-core architecture with Bluetooth Low Energy 5.2 and other 2.4 GHz protocols, giving you a flexible platform for both current and future wireless standards.
-
High sensitivity RF with integrated chip antenna – Excellent receiver sensitivity and a tuned on-board antenna provide robust wireless links and long range, while avoiding the need for complex RF and antenna design.
-
Compact footprint with up to 48 GPIOs – Small module size yet plenty of I/O means you can build feature-rich products without sacrificing valuable PCB space.
-
**Rich peripheral set (USB, ADC, serial and audio interfaces) – SPI, I²C, UART, USB, ADC and audio interfaces such as I²S and PDM make it straightforward to connect sensors, actuators, external memory and audio front ends.
-
Hardware-based security features – Integrated cryptographic engines and trusted execution support help implement secure boot, encrypted communication and protection of sensitive keys and firmware.
-
Industrial-grade operating temperature range – Reliable operation from -40 to +105 °C makes it suitable for demanding industrial, outdoor and high-temperature environments.
-
Globally pre-approved module platform – Existing approvals for major regions streamline RF certification tasks and shorten time to market for end products.
What’s in this range?
All the variants in the range and a comparison of what they offer
Module type | Bluetooth 5.2 multiprotocol RF module with chip antenna |
SoC | Dual-core Cortex-M33 nRF5340 (application and network cores) |
Flash memory | 1 MB (application core) + 256 kB (network core) |
RAM | 512 kB (application core) + 64 kB (network core |
Dimensions | 9.3 × 14.3 × 1.85 mm |
GPIO count | 48 |
Operating temperature range | 40 to +105 °C |
Supported protocols | Bluetooth Low Energy 5.2, IEEE 802.15.4-2006 (Zigbee/Thread), proprietary 2.4 GHz; supports ANT+ |
Direction finding | Angle of Arrival (AoA) and Angle of Departure (AoD) supported |
Bluetooth data rates | 2 Mbps, 1 Mbps, 500 kbps, 125 kbps |
IEEE 802.15.4 data rate | 250 kbps |
Proprietary 2.4 GHz data rates | 1 Mbps, 2 Mbps |
TX power | -20 to +3 dBm configurable |
