FG160 5G Sub6 GHz SMD module

Technology
5G modules
Partner
Fibocom

The Fibocom FG160-NA is a 5G NR Sub-6 module featuring 3GPP Release 16 capabilities and backward compatibility with LTE and WCDMA networks. Powered by the Qualcomm Snapdragon® X62 modem chipset, it delivers impressive speeds of up to 3.5Gbps downlink and 900Mbps uplink over 5G. With NR Carrier Aggregation (NR CA), the FG160-NA enhances 5G performance by extending coverage, increasing capacity, and optimising throughput—making it an ideal solution for Fixed Wireless Access (FWA) applications.

Designed for efficiency, the FG160-NA supports OpenCPU, reducing costs and power consumption while enabling advanced features such as 160MHz bandwidth, 4096 QAM, and Wi-Fi 6E support.

Built in a compact 41x44x2.75mm LGA form factor, the FG160-NA is compatible with Fibocom’s FG150 5G module, ensuring a seamless upgrade path. With support for multiple Internet protocols and industry-standard interfaces, it is well-suited for integration into cellular devices like CPEs, set-top boxes (STBs), industrial PCs (IPCs), and outdoor units (ODUs). The FG160-NA is designed specifically to support North American mobile networks.

FG160 5G Sub6 GHz SMD module

Range features

An overview of what’s in the range

  • 3GPP Release 16 support – Ensures advanced 5G performance and efficiency
  • Qualcomm Snapdragon® X62 chipset – Delivers high-speed connectivity
  • 5G NR Sub-6 with LTE/WCDMA fallback – Ensures seamless network compatibility
  • 3.5Gbps downlink / 900Mbps uplink – Enables ultra-fast data transfer
  • NR Carrier Aggregation (NR CA) – Expands coverage and improves throughput
  • OpenCPU support – Reduces system cost and power consumption
  • 160MHz bandwidth & 4096 QAM – Enhances network capacity and speed
  • Wi-Fi 6E compatibility – Enables next-gen wireless performance
  • LGA form factor (41x44x2.75mm) – Compact design for easy integration
  • Compatibility with FG150 module – Provides a smooth upgrade path
  • Multiple interfaces & protocol support – Ensures seamless device integration
  • Designed for North American networks – Optimised for regional connectivity
SpecificationsSpecifications

Package

LGA

Dimension (mm)

41x44x2.75

Sub-6

n2/5/7/12/14/25/30/48/41/70/66/71/77/78

mmWave

NA

LTE FDD

B2/4/5/7/12/13/29/30/66/71

LTE TDD

B41/46(LAA)/48

WCDMA

NA

Operation mode

NSA&SA

Antenna

4/6/8+1(GNSS)

Operating voltage

3.3V~4.4V, Typical 3.8V

Operating temp

-30°C – +75°C

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