Fanless Embedded Computer (Matrix)

Technology
Fanless IPC
Partner
ADLINK

The Adlink Matrix family of embedded industrial computers offer ultra-reliable, flexible platforms backed with Intel® long life cycle CPU’s. They offer both compact (MXE) and expandable (MXC) versions along with their cost effective value (MVP) range.

Adlink has created a highly configurable offering covering high performance (with the addition of GPU add in cards) and low power applications. HALT (Highly Accelerated Life Testing) certifies these platforms to ensure reliability in demanding applications.

Fanless Embedded Computer (Matrix)

Range features

A high level overview of what this range offers

  • Low (Atom) to high (Xeon) CPU options
  • GPU accelerator add in capable (MXM + PCIe)
  • Fanless & cableless design for high reliability
  • Wide range of I/O options
  • RAID support
  • Multiple PCI and PCIe expansion options
  • Adlink SEMA (Smart Embedded Monitoring Agent) support
  • Tested to work in wide temperature and harsh/dusty environments applications
  • Industry leading MTBF
  • Ideal for Edge and AI

Downloads

for Fanless Embedded Computer (Matrix)

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Adlink GPU Brochure
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What’s in this range?

All the variants in the range and a comparison of what they offer

ModelCPURAMI/ORugged option

MXC-6600 series

9/8th Gen Intel Xeon – Core I series

Up to 32Gb RAM

2/4 PCie slots, USB 3.1, RAID, M.2 2 x USIM, 2 x Gbe, 6 x COM,TPM 2.0, HDMI, 2x DP++, 8 ch DI/DO, WiFi/BT/3G/4G LTE/LoRa kits available

Yes -20 – +70 oC.

MXC-6400 series

6th Gen Intel Core I series

Up to 32Gb RAM

1 x PCI/2 x PCIe slots, 6 x USB3.0, 2 x miniPCIe, 1 x USIM, 3 x Gbe, TPM 1.2, 2 x 2.5” H/S SATA III,WiFi/BT/3G/4G LTE/LoRa kits available.

Yes -20 – +70 oC.

MVP-6100

9/8th Gen Intel Xeon/Core I Series

Up to 32Gb RAM

1/3 x PCI/PCIe slots, 2 x 2.5” SATA III SSD/HDD/M.2, 2x DP++,DVi,VGA,3x Gbe,3x COM,TPM 2.0, USB 3.1 Gen 1/2, USB 2.0, WiFi/BT/3G/4G LTE/LoRa kits available.

Yes -20 – +60oC

MVP-6100-MXM

9/8th Gen Intel Xeon/Core I Series

Up to 32Gb RAM

1/3 x PCI/PCIe slots, MXM GPGPU expansion, 2 x 2.5” SATA III SSD/HDD/M.2, 2x DP++,DVi,VGA,3x Gbe,3x COM,TPM 2.0, USB 3.1 Gen 1/2, USB 2.0, WiFi/BT/3G/4G LTE/LoRa kits available.

Yes -20 – +60oC

ModelCPURAMI/ORugged option

MXE-5600 series

9th Gen Intel Xeon/Core I series

Up to 32Gb ECC/Non ECC

2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.02x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0

Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280

Embedded expansion: Mini PCIe, M.2 3042, 2x USIM

Front accessible I/O and adaptive function module v.2

Optional Wi-Fi, BT, 3G, 4G LTE, LoRa wireless kit (w/ antenna)

Yes -20oC – +70oC

MXE-1500 series

Intel Celeron N3160/N3060 SoC

Up to 8Gb

3x independent displays: DP, VGA (optional LVDS or DP)

Built-in ADLINK SEMA management solution

3x GbE, 2x RS-232/422/485, 2x RS-232, 4x DI/ 4x DO

Optional: extra 2x RS-232/422/485, TPM2.0, amplifier

2x USB 3.0, 5x USB 2.0, 1x 2.5" SATA, CFast, Mini PCIe, I2C

Last generation to support Windows 7 OS

Yes -20oC – +70oC

MVP-5100-MXM series

9/8th Gen Intel Core I series

Up to 32Gb

Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0

3x USB 3.1 Gen 1, 3x USB 2.0

Storage options: 2x 2.5" SATA, M.2 2280

Front accessible I/O and adaptive function module 2.0 options

Mini PCIe, M.2 3042, 2x USIM

World leading embedded GP/GPU computing options built-in

Yes -20oC – +60oC

MVP-5100 series

9/8th Gen Intel Core I series

Up to 32Gb

Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/ TPM2.0

2x USB3.1 Gen2 + 1x USB3.1 Gen1 + 3x USB2.0

Rich storage:2x 2.5" SATA, CFast, M.2 2280

Embedded Expansion: Mini PCIe/ M.2 3042/ 2x USIM

Front accessible I/O and adaptive function module v.2 option

Yes -20oC – +60oC

MXE-200 series

Intel Atom E3900 series

Up to 8Gb

Compact fanless design: 140(W) x 110(D) x 58(H) mm

1x DisplayPort, 2x USB 2.0, 2x USB 3.0, 2x GbE ports, 2x COM ports (RS-232/422/485)

2x mPCIe slots, 1x USIM slot, 1 x mSATA, 1x Micro SD slot

1 x 2.5 " SATA SSD by storage kit or isolated 8x DI/ 8x DO (Optional)

eSIM support (by project) (optional)

Built-in ADLINK SEMA management solution

Yes -40 – +85oC

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