COM Express-RLP Type 6
The ADLINK Express-RLP is a high-performance COM Express® Type 6 Basic size computer-on-module engineered for advanced edge computing and mission-critical AIoT applications. Built on 13th Gen Intel® Core™ mobile processors with hybrid architecture, Express-RLP delivers industry-leading compute, graphics, AI inference performance, and real-time capabilities in compact form factor. Featuring PCIe Gen4, fast DDR5 memory, multiple display and USB4 interfaces, plus optional rugged operating temperature support, it’s ideal for automation, robotics, industrial control, medical imaging, and autonomous systems.
Range features
A high level overview of what this range offers
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13th Gen Intel® Core™ mobile processors Delivers powerful hybrid performance with up to 14 cores (6 Performance + 8 Efficient) and 20 threads for demanding compute and multitasking workloads.
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Advanced AI acceleration Integrated Intel® Iris® Xe graphics with AVX-512 VNNI and DL Boost enables on-device AI inferencing, boosting analytics and vision processing without external accelerators.
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Up to 64 GB DDR5 memory @ 4800 MT/s High-speed DDR5 memory with in-band ECC delivers responsive system performance and reliable data integrity.
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PCIe Gen4 connectivity Provides high bandwidth for next-generation peripherals, storage, and accelerated networking — essential for data-intensive applications.
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Rich I/O & display support Supports up to four independent displays via DDI/LVDS and USB4/Thunderbolt 4, offering flexible visualisation options for HMI, monitoring, or control systems.
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Deterministic real-time performance With Intel® TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking), the module supports ultra-low latency and deterministic scheduling for industrial automation and robotics.
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Industrial-grade & rugged options Optional extended temperature operating support enhances reliability in harsh environments, expanding deployment to outdoor or extreme industrial conditions.
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COM Express Rev. 3.1 basic form factor Standardised COM Express Type 6 footprint simplifies carrier board design and accelerates time-to-market for embedded systems.
What’s in this range?
All the variants in the range and a comparison of what they offer
| Category | Specification |
|---|---|
Form Factor | COM Express® Rev. 3.1 Basic Size (Type 6) |
Processor Platform | 13th Gen Intel® Core™ mobile processors (formerly Raptor Lake-P) |
CPU Cores / Threads | Up to 14 cores (6 P-cores
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Graphics | Intel® Iris® Xe Graphics (up to 96 EUs) |
Memory | Up to 64 GB DDR5 SO-DIMM, 4800 MT/s, in-band ECC |
PCI Express | PCIe Gen4 (16 lanes), plus 5x PCIe Gen3 |
Display Interfaces | 4x displays via DDI/LVDS (optional eDP, VGA) or 2x USB4/Thunderbolt 4 |
Network Support | 2.5 GbE (Intel®) with TSN capability |
Real-Time Support | Intel® TCC (Time-Coordinated Computing), TSN |
AI Acceleration | Intel® AVX-512 VNNI, Intel® DL Boost |
Operating Temperature | Commercial and optional extreme rugged variants |
Power | 15 W / 28 W / 45 W TDP options |
