COM-HPC-mMTL mini computer-on-module
- Technology
- Single board computers
- Partner
- ADLINK
The ADLINK COM-HPC-mMTL is a compact, high-performance COM-HPC Mini computer-on-module (COM) designed for demanding embedded and edge computing applications in space-constrained systems. Powered by Intel® Core™ Ultra (Meteor Lake) processors, this rugged module delivers industry-leading compute, graphics, and AI acceleration in a 95 × 70 mm form factor.
With support for up to 16 CPU cores, integrated Intel® Arc-based GPU, a dedicated AI-acceleration NPU, and up to 64 GB LPDDR5x memory, the COM-HPC-mMTL provides the performance and efficiency required for next-generation edge use cases such as industrial automation, medical imaging, robotics, and autonomous systems.
Engineered for flexibility, it offers extensive I/O including PCIe lanes, USB4, multiple display interfaces, Ethernet, SATA, and more — simplifying system design while delivering high-bandwidth connectivity and scalable performance for demanding workloads.
Range features
A high level overview of what this range offers
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Intel® Core™ Ultra Processing Power: Up to 16 CPU cores with hybrid architecture for outstanding multithreaded performance and energy efficiency.
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Advanced Integrated Graphics: Intel® Arc-based GPU with multiple Xe cores accelerates graphics and compute tasks without external GPUs.
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Dedicated AI Acceleration: Integrated NPU boosts edge AI inference with dedicated hardware acceleration for deep learning workloads.
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Compact COM-HPC Mini Form Factor: Space-efficient 95 × 70 mm design enables deployment in size-restricted systems without performance compromise.
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High-Bandwidth Memory: Up to 64 GB LPDDR5x soldered memory delivers high throughput and low latency for data-intensive applications.
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Rich I/O Connectivity: Supports PCIe Gen lanes, USB4, USB3/2.0, SATA, dual 2.5 GbE Ethernet, and multiple display interfaces for flexible system integration.
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Rugged & Reliable: Optional extended operating temperatures (-40 °C to +85 °C) and solid-state design for industrial and harsh environments.
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Scalable Platform: COM-HPC ecosystem support eases carrier board design and long-term availability for embedded solutions.
Range features
A high level overview of what this range offers
| Feature | COM-HPC-mMTL-125H-16G | COM-HPC-mMTL-125U-16G | COM-HPC-mMTL-125U-64G | COM-HPC-mMTL-155H-32G | COM-HPC-mMTL-155H-64G |
|---|---|---|---|---|---|
Processor | Intel Core Ultra 5 125H | Intel Core Ultra 5 125U | Intel Core Ultra 5 125U | Intel Core Ultra 7 155H | Intel Core Ultra 7 155H |
CPU Cores / Threads | Up to ~14C / ~22T | Up to ~14C / ~22T | Up to ~14C / ~22T | Up to ~16C / ~22T | Up to ~16C / ~22T |
Graphics Cores | Intel Arc Xe | Intel Arc Xe | Intel Arc Xe | Intel Arc Xe | Intel Arc Xe |
Memory | 16 GB LPDDR5x | 16 GB LPDDR5x | 64 GB LPDDR5x | 32 GB LPDDR5x | 64 GB LPDDR5x |
PCIe Lanes | Up to 16 | Up to 16 | Up to 16 | Up to 16 | Up to 16 |
Ethernet | 2x 2.5 GbE | 2x 2.5 GbE | 2x 2.5 GbE | 2x 2.5 GbE | 2x 2.5 GbE |
USB / DDI / SATA | Multi-interface support | Multi-interface support | Multi-interface support | Multi-interface support | Multi-interface support |
Operating Temperature | Commercial / Rugged | Commercial / Rugged | Commercial / Rugged | Commercial / Rugged | Commercial / Rugged |
Form Factor | COM-HPC Mini (95×70 mm) | COM-HPC Mini (95×70 mm) | COM-HPC Mini (95×70 mm) | COM-HPC Mini (95×70 mm) | COM-HPC Mini (95×70 mm) |
