Electrostatic chuck power supplies for enhanced semiconductor manufacturing

Our software-driven electrostatic chuck power supplies offer an array of features that provide significant benefits while accommodating a variety of demanding applications.

Documented use shows that customers have seen increases in efficiency and throughput equal to three times that of other supplies. Additionally, our models virtually eliminate sticky wafer and wafer popping issues, thus ensuring better control over particle contamination.

The lockable front panel interface of these amplifiers/supplies optimises many processes by enabling the operator to control parameters such as over-current, wafer-present, and wafer-clamped thresholds, clamp voltage, offset voltage, and internal or external amplitude/offset control. The dynamic features also enable electrostatic chuck profiles to be uploaded to the unit via a user-friendly software interface. The profiles, which are stored internally using non-volatile memory, are used to effectively chuck and de-chuck the wafer. Both Coulombic and Johnsen-Rahbek electrostatic chuck technologies are supported.

Given the versatility of electrostatic chuck power supplies and its dial-in performance, the unit can be used in multiple unique tools/processes, therefore, eliminating the need to specify a new supply for each unique tool/process in a facility.