Wi-Fi and Bluetooth modules for IoT connectivity

These highly integrated, cost-effective and low-power consumption modules have all the usual Wi-Fi functionality plus seamless roaming capabilities and advanced security. Incorporating the most advanced Enhanced Collaborative Coexistence algorithms and hardware mechanisms, they have an extremely collaborative WLAN and Bluetooth coexistence.

The smallest and most powerful BT long range multiprotocol module suitable for BLE/ Thread/ Zigbee/ ANT+/ NFC applications with an MCU and built-in antenna.

Compact, high performance BT5 multiprotocol modules suitable for BLE/ ANT+/ NFC applications with an MCU and built-in antenna.

A compact long-range, direction finding module suitable for BLE/ Thread/ Zigbee/ ANT+/ NFC applications with an MCU and built-in antenna.

For internally mounted computer expansion cards and associated connectors, ideal for solid-state storage applications and particularly in smaller devices such as tablets and ultra-books.

A small version of the PCI Express peripheral interface for laptop computers and other portable devices. Using standard PCI Express signalling.

These modules provide a low power, cost-effective solution for M2M. Ideal for high throughput networking and multimedia applications that require better quality Wi-Fi performance.

USI offer a wide range of miniaturised hosted and hostless IoT SiP solutions that have comprehensive design capabilities and advanced packaging solutions.

Wi-fi and combination SiP modules for embedded applications.

The XPort EDGE is the next generation embedded serial to Ethernet module in the same patented form-factor as the original XPort®.

xPico® 200 series of embedded Wi-Fi® gateways offer one of the smallest and highly integrated industrial Wi-Fi, Ethernet and Bluetooth® solutions.

The latest Bluetooth 5.2 modules with dual core processor.

Qualcomm based Wi-Fi 6 & 6E solution in Mini PCIe formfactor design.

These modules provide a low power, cost-effective solution for M2M. Ideal for high throughput networking and multimedia applications that require better quality wi-fi performance.

The most versatile Wi-Fi 6 +BT M.2 collections for all types of industrial applications with innovative specifications.

Wi-Fi solutions from Insight SiP are perfectly suited for devices requiring low cost and low power wireless connectivity. The modules are based on chips from NXP and offer a complete Wi-Fi and Bluetooth Low Energy node in a very small 12 x 12mm form factor for the highest integration on application PCB. All modules include the antenna, the RF matching circuit, all decoupling and load capacitors plus crystal oscillators. The antenna was designed to be compatible with several end applications, illustrating Insight SiP’s expertise in RF & Front End miniaturisation and antenna integration.

The WNFQ-290BE(BT) is a Qualcomm-based Wi-Fi 7 (802.11be) module in a compact M.2 2230 E Key form factor. It supports tri-band operation on 2.4 GHz, 5 GHz, and 6 GHz, with up to 160 MHz channel bandwidth and backward compatibility with 802.11 be/ax/ac/a/b/g/n standards.

The WNFQ-291BEI(BT) is a Qualcomm-based Wi-Fi 7 (802.11be) module in a compact M.2 2230 E Key form factor.

The WNFQ-292BE(BT) is a Qualcomm-based Wi-Fi 7 (802.11be) module in a standard M.2 2230 E Key form factor.

SparkLAN’s new Wi-Fi 7 series delivers fast, reliable wireless for everything from robots to video calls.

WPEQ-268AXI(BT) is Qualcomm’s first Wi-Fi 6E mini PCIe module supporting tri-band (2.4/5/6 GHz) with DBDC mode, allowing simultaneous dual-band operation and up to 160 MHz bandwidth.

The WNFS-161AXI(BT) is an M.2 Wi-Fi 6/6E tri-band module with integrated Bluetooth 5.3, powered by Synaptics chipset technology. It supports 2.4 GHz, 5 GHz, and 6 GHz bands for high-speed, low-latency wireless performance.

SparkLAN WUBT-281AX is a compact USB 3.0 WLAN module with 2×2 MU-MIMO, supporting 802.11ax/ac/b/g/n. It integrates WLAN MAC, baseband, and dual-band RF in one chip for cost-effective M2M connectivity via a single USB port.

The AP6676SDSR is a compact SiP module supporting Wi-Fi 6E (2.4/5/6 GHz) and Bluetooth 5.3. It uses advanced 802.11ax features like OFDMA, 1024-QAM, Target Wake Time (TWT), and MU-MIMO to deliver faster speeds, better range, improved capacity, and longer battery life for connected devices.

The AP6275S is a compact, high-performance SiP module supporting Wi-Fi 6 (802.11ax) and Bluetooth 5.3. With OFDMA, 1024-QAM, TWT, and MU-MIMO, it delivers faster speeds, better coverage, higher capacity, and longer IoT battery life. It ensures smooth streaming, stable connections in dense environments, and advanced security with WPA3 and seamless roaming.

The WL72917_8M from SparkLAN is a compact Wi-Fi 6 and BLE 5.4 A-IoT module for reliable, energy-efficient wireless connectivity. Powered by a Silicon Labs chipset with an ARM Cortex-M4F core (up to 180 MHz) and AI/ML hardware acceleration, it enables fast, low-power machine learning.

The Sparklan WNFQ-268AXI(BT) is a tri-band Wi-Fi 6 (802.11ax) module in a standard M.2 2230 E-Key form factor. It supports 2.4 GHz, 5 GHz, and 6 GHz bands with Dual-Band Dual-Concurrent (DBDC) operation, 2×2 MU-MIMO, and up to 160 MHz channels. Wi-Fi runs over PCIe and Bluetooth over USB.

The SparkLAN WNFT-238AX(BT) is SparkLAN’s first Realtek-based Wi-Fi 6 (802.11ax) M.2 module. Powered by the latest Realtek combo chip, it supports full IEEE 802.11 ax/ac/a/b/g/n standards with 2×2 MU-MIMO (2T2R).

The WNFS-267AXI(BT) is a compact Wi-Fi 6E (2.4/5/6 GHz) M.2 2230 E-Key module with seamless roaming and advanced security.

The SparkLAN WPEQ-405AX is a Qualcomm QCN9074-based Wi-Fi 6 AP module with 4×4 MU-MIMO on 5 GHz, supporting 160 MHz channels and speeds up to 4.8 Gbps.

The SparkLAN WNFQ-258ACN(BT) is a dual-band Wi-Fi 5 (802.11ac/a/b/g/n) M.2 2230 module based on the Qualcomm Atheros QCA6174A chipset.

The SparkLAN WNFT-237ACN(BT) is an 802.11ac/a/b/g/n dual-band Wi-Fi + Bluetooth M.2 module (Key A/E) based on the Realtek RTL8822CE chipset.

The SparkLAN WNFQ-261ACNI(BT) is an 802.11ac/a/b/g/n dual-band Wi-Fi + Bluetooth M.2 2230 module based on the Qualcomm Atheros QCA6174A chipset.

The SparkLAN WNFQ-262ACNI(BT) is an industrial-grade QCA6174A B-Key module supporting 802.11ac/a/b/g/n dual-band Wi-Fi + Bluetooth in an M.2 2242 form factor.

The SparkLAN WUBQ-159ACN(BT) is an 802.11ac/a/b/g/n dual-band USB Wi-Fi module (Wi-Fi 5) based on the Qualcomm QCA9377-7 chipset. It supports 1T1R with RX diversity and Wi-Fi/Bluetooth co-existence, delivering speeds up to 433 Mbps for Wi-Fi and 1–3 Mbps EDR for Bluetooth.

The SparkLAN WUBT-236ACN(BT) is a highly integrated single-chip Wi-Fi 5 USB module that supports dual-stream 802.11ac with MU-MIMO (Multi-User, Multiple-Input, Multiple-Output).

The SparkLAN WUBT-239ACN(BT) is a highly integrated single-chip USB module that combines dual-band Wi-Fi 5 (802.11ac/abgn) and Bluetooth in one compact solution.

SparkLAN WUBT-239ACN(BT) is a highly integrated single-chip Wireless LAN (WLAN) and Bluetooth (BT) USB module.

AP6398S is a fully integrated Wi-Fi combo module (Wi-Fi 5) with advanced security and seamless roaming capabilities.

WPEQ-261ACN (BT) is a single-die WLAN combo module that supports 2×2 MU-MIMO with two spatial streams and is compliant with IEEE 802.11ac/a/b/g/n standards.

AP6256 is an 802.11ac/a/b/g/n dual-band 1T1R Wi-Fi combo SiP module (Wi-Fi 5). Supporting the SISO standard, it efficiently connects to various vendors’ 1×1 access points and achieves speeds up to 433.3 Mbps.

The WNSQ-261ACN(BT) is a high-performance 802.11ac/a/b/g/n dual-band Wi-Fi combo module in an M.2 LGA Type 1216 form factor, powered by the Qualcomm Atheros QCA6174A-5 chipset.

The AP6212SD is a compact, highly integrated Wi-Fi + Bluetooth module that supports 802.11b/g/n (1T1R) Wi-Fi and Bluetooth 5.2, optimised for mobile and handheld wireless systems.

This compact module functions as a fully autonomous Bluetooth LE and Wi-Fi 6 radio node, requiring only a battery for operation. It forms the core of next-generation IoT devices demanding robust wireless connectivity.

The xPico® 240 is a compact, production-ready embedded IoT gateway designed to accelerate OEM development for industrial applications.

The xPico® 250 is a compact, industrial-grade IoT gateway that accelerates OEM deployment with dual-band Wi-Fi, Ethernet, Bluetooth, and built-in enterprise security.

The xPico® 270 is a compact, industrial-grade IoT gateway that enables fast deployment with dual-band 802.11ac Wi-Fi, Ethernet, Bluetooth, and Bluetooth LE.

The ISP1507 Series from InsightSIP is a compact Bluetooth 5.0 Low Energy (BLE) module designed for both simple and advanced IoT applications that do not require Long Range connectivity.

The ISP1907 Series from InsightSIP is a next-generation Bluetooth 5.1 Low Energy (BLE) module available in two variants, designed for applications requiring Long Range and Direction Finding capabilities.

The ISP1807 Series from InsightSIP is a compact Bluetooth 5 Low Energy (BLE) module designed for advanced IoT applications requiring Long Range connectivity.

This ultra-compact LGA module, measuring just 8 × 8 × 1 mm, is built around the ultra-low-power nRF54L15 chip, offering advanced security features and multi-protocol radio support.

The ISP4520 module offers a unique combination of two leading IoT wireless technologies—Bluetooth Low Energy (BLE) and LoRa—in a highly miniaturised, class-leading package.

The ISP3080 is a miniaturised module designed for RTLS, access control, indoor positioning, and security applications.

SparkLAN Technology introduces the WL71340, a compact, low-cost, and highly integrated wireless module designed to bring Bluetooth Low Energy (BLE) and IoT functionality to a wide range of applications.

SparkLAN Technology presents the AP71582R, a compact, low-cost, and highly integrated wireless module designed to enable multiprotocol 2.4 GHz IoT connectivity.