FM550 5G Sub6 GHz M.2 module
This 5G Sub-6 eMBB module supports 3GPP Release 16 and 5G NR standards for enhanced performance and lower latency. With 5G standalone (SA) support, it enables full 5G capabilities including network slicing and ultra-low latency.
Featuring a standard M.2 form factor and rich interfaces like USB and PCIe, it ensures reliable integration into various devices. Backed by reference designs and expert technical support, it simplifies and accelerates product development.
Range features
A high level overview of what this range offers
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Regional support – Designed for EMEA, APAC, and Australia markets
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5G network compatibility – Supports both 5G SA (Standalone) and NSA (Non-Standalone) architectures
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High performance – Delivers faster speeds, greater capacity, and lower latency
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Advanced chipset – Powered by Samsung S5300 with 4nm manufacturing process
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Carrier aggregation
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Typical: 2CC NR CA within 200 MHz bandwidth
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Maximum: Up to 5CC NR CA
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Integrated CPU – Built-in single-core ARM Cortex-A55, 1.5 GHz
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High-speed interface – Supports PCIe for rapid data transfer
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Target applications – Ideal for Fixed Wireless Access (FWA), CPE, gateways, and routers in eMBB scenarios
What’s in this range?
All the variants in the range and a comparison of what they offer
| Category | Specification |
|---|---|
Package | M.2 |
Dimension (mm) | 30x52x2.3mm |
NR | n1/3/5/7/8/20/26/28/38/40/41/66/67/71/75/76/77/78 DL 4×4 MIMO: n1/3/7/38/40/41/75/76/77/78 |
UL | 2×2 MIMO: n38/40/41/77/78 |
LTE | FDD B1/3/5/7/8/20/26/28/32/66/67/71 DL 4×4 MIMO: B1/3/7/32 |
LTE | TDD B38/40/41/42/43/48 DL 4×4 MIMO: B38/40/41/42/43/48 |
LTE | LAA B46 |
WCDMA | B1/3/5/8 |
Antenna | 4 |
Operating voltage | 3.135V~4.4V, Typical 3.8V |
Operating temperature | -30℃~+75℃ |
Extend temperature | -40°C ~ +85°C |
AT Command | Set 3GPP TS 27.007 and 27.005, proprietary FIBOCOM AT Commands |
