United Kingdom
MECS 19” Computing Platform
Supplier: ADLINK
Technology type: GPGPU-HPC
Based on ADLINK’s years of experience in rugged embedded design and using only the highest-quality mechanical parts, the MECS-6110 and MECS-7210 are built to withstand rugged environmental conditions and can operate from -5°C to +55°C.
The Adlink MECS series are offered in 19” 1U (MECS-6110) and 2U (MECS-7210) platforms. Both systems provide different capabilities at the edge. The 1U MECS-6110 uses a single Intel® Xeon® D-2100 processor with support for up to 256GB of memory, while the larger 2U MECS-7210, designed for heavy workloads, is offered with dual Intel® Xeon® Scalable Silver/Gold Processors and a maximum 512GB memory. The MECS-7210 includes redundant, hotswappable-storage and redundant power supplies giving uptime assurance and easy maintenance. Both systems fully comply with the Open Telecom IT Infrastructure (OTII) as defined by the Open Data Center Committee (ODCC). All platforms are also validated for NVIDIA NGC-Ready, Amazon AWS Device and Intel® Select Solution for uCPE.
Range features
A high level overview of what this range offers
- Rugged Edge Platform
- Scalable performance
- 1U or 2U 19”
- NVIDIA NGC-Ready
- OTII compliant
- Amazon AWS certified
- Intel uCPE
- Wide Temp Support
- Ideal for smart cities, retail and manufacturing
What's in this range?
All the variants in the range and a comparison of what they offer
|
Model |
CPU |
RAM |
Key features |
|---|---|---|---|
|
MECS-6110 |
Intel® Xeon® D- 2100 family |
4x DDR4-2666 1DPC RDIMM ECC REG up to 256GB |
1x Intel® Xeon® D-2100 family processor 4x DDR4-2666 1DPC RDIMM ECC REG up to 256GB 2x 2.5” SATA bays and 2x M.2 M Key interfaces 420mm depth 1U 19” rackmount form factor Built-in Intel® QAT support TPM 1.2/2.0 modul 2x IEEE 1588 v2 1PPS/TOD RJ-45 port and 4x 1PPS SMA input/output Specifications Verified for Intel® Select Solution for uCPE on CentOS |
|
MECS-7210 |
Intel® Xeon® Scalable Silver/Gold Processors |
16x DDR4 2666 ECC REG memory up to 512GB |
Up to 2x 1st or 2nd Gen Intel® Xeon® Scalable Processors 16x DDR4 2666 ECC REG memory up to 512GB 2x 2.5" SATA bays 3x M.2 interfaces on board 2x PCIe x16 Gen3 single/dual-slot FHFL interfaces TPM 1.2/ 2.0 module 2U 19’’ rackmount form factor, 420mm depth Validated as a NGC-Ready edge server and AWS IoT Greengrass edge device
|
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