Deep learning AIoT

Technology
AIoT
Partner
ADLINK

Adlink bring Deep Learning to the edge with a range of NVIDIA based GPGPU heterogeneous compute platforms. These products are based around a range of NVIDIA GPU chips from Jetson to Xavier, along with server and fanless solutions with long life NVIDIA GPGPU’s in both PCIe and MXM expansion.

Deep learning AIoT

Range features

A high level overview of what this range offers

  • Fanless compact Form Factor
  • Integrated GPU
  • Flexible performance
  • NVIDIA Jetson/Xavier
  • Suitable for Inference and Deep Learning
  • PoE support for IP cameras
  • Wide range of I/O options
  • Support Wifi/GSM
  • Wide temp range support
  • Intel host CPU + MXM GPU

Contact us

To request further information and availability please feel free to contact us right away.Or just fill out our contact form for a member of the sales team to respond to you.

Mandatory field: please enter your phone number.

In submitting this enquiry form you confirm you have read and agree to our privacy policy .

There was an error while sending the form. Please try again.

What’s in this range?

All the variants in the range and a comparison of what they offer

ModelCPURAMKey FeaturesRugged Option

DLAP-3000-CFseries

8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor

Up to 64GB DDR4 non-ECC memory

ADLINK MXM Graphics module support (Type A/B, up to 120W)

8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor

Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)

DisplayPort (2 from CPU, 4 from MXM)

1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module

Reliable Molex type 12V DC-in connector

No

DLAP-3100-CF series

8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor

Up to 64GB DDR4 non-ECC memory

ADLINK MXM Graphics module support (Type A/B, up to 120W)

8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor

Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)

DisplayPort (2 from CPU, 4 from MXM)

1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module

Reliable Molex type 12V DC-in connector

1x Intel® i219-LM) and 5x Intel® i210-AT

No

DLAP-3200-CF series

8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor

Up to 64GB DDR4 non-ECC memory

ADLINK MXM Graphics module support (Type A/B, up to 120W)

8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor

Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)

DisplayPort (2 from CPU, 4 from MXM)

1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module

Reliable Molex type 12V DC-in connector

1x Intel® i219-LM and 3x Intel® i210-AT

2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support

No

DLAP-4000 Series

8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor

Up to 64GB DDR4 non-ECC memory

NVIDIA® Quadro® PEG card support

8th/9th Gen Intel® Core™ i7/i5/i3 processor

Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)

1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards

1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module

300W/500W Flex ATX PSU

No

DLAP-8000 Series

9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset

Up to 64GB DDR4 / ECC options*

9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset

Dual SODIMMs for up to 64GB DDR4 / ECC options*

Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0

2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0

Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280

Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM

Front accessible I/O and adaptive Function Module v.2 option

Flexible and powerful PCIe expansions via backplane

No

AVA-5500 series

6th/7th Gen Intel® Core™ i7 Processors and NVIDIA Quadro® GPU MXM 3.1 Type A/B module on PCI Express x16

Up to 32Gb DDR4

  • 8x M12 GbE (4x PoE), 4x RS-422, 4x USB 3.0, 1x DVI-I, 4x DisplayPort with lockable connectors
  • Multiple storage options: 2x 2.5" SATA 6.0 Gb/s drive bays, 1x M.2 2280 slot, 1x CFast socket
  • GNSS/3G/4G/WLAN support via 2x Mini PCIe slots and 2x USIM slots
  • 4x isolated DI and 4x isolated DO
  • MVB/CAN bus support through Mini PCIe add-on module
  • Wide range DC input: 24VDC, 36VDC, 72VDC and 110VDC
  • EN50155-compliant, rugged, fanless design for harsh operating environments

Yes,Class OT1: -25°C to 55°C with P3000 MXM module (supported by condition) Class OT3: -25°C to 70°C with P1000 MXM module

ModelCPURAMKey FeaturesRugged Option

DLAP-211-JNX

Jetson Xavier™ NX

Up to 8Gb RAM/16Gb eMMC

Graphic Output 1 HDMI 2.0 (w. lock)

Front Panel I/O Interface Ethernet 2x GbE USB 3.0 4x Type A Audio Mic-in, line-out (Optional) Rear Panel I/O Interface USB 2.0 1x OTG Serial Port 1x COM RS-232 CAN Bus 1 CAN bus (2.0b)

Internal I/O Interface Mini PCIe 1x PCIe mini-card slot M.2 M.2 B key 3042 socket USIM 1x USIM slot DIO 4 channel DIO Debug Port 1x debug console, Storage Device SATA Extension M.2 B key support SATA SD Card 1x SD. Dimensions:148(W)x120(D)x49.1(H)mm

Yes -20oC – +70oC

DLAP-211-Nano

NVIDIA® Jetson Nano™

Up to 4Gb RAM/16Gb eMMC

Graphic Output 1 HDMI 2.0 (w. lock)

Front Panel I/O Interface Ethernet 2x GbE USB 3.0 4x Type A Rear Panel I/O Interface USB 2.0 1x OTG Serial Port 1x COM RS-232 Internal I/O Interface Mini PCIe 1x PCIe mini-card slot M.2 M.2 B key 3042 socket USIM 1x USIM slot DIO 4 channel DIO Debug Port 1x debug console, Storage Device SATA Extension M.2 B key support SATA SD Card 1x SD. Dimensions:148(W)x120(D)x49.1(H)mm

Yes -20oC – +70oC

DLAP-201-JT2

NVIDIA® Jetson™ TX2

Up to 8Gb RAM/32Gb eMMC

Graphic Output 1 HDMI 2.0 (w. lock)

Front Panel I/O Interface Ethernet 2x GbE USB 3.0 3x Type A Audio Mic-in, line-out (Optional) Rear Panel I/O Interface USB 2.0 1x OTG Serial Port 1x COM CAN Bus 1 CAN bus (2.0b)

Internal I/O Interface Mini PCIe 1x PCIe mini-card slot USIM 1x USIM slot DIO 4 channel DIO Debug Port 1x debug console Storage Device SATA Extension mSATA SD Card 1x SD. Dimensions:148(W)x105(D)x50(H)mm

Yes -20oC – +70oC

DLAP-301-JNX

NVIDIA® Jetson Xavier™ NX

Up to 8Gb RAM/16Gb eMMC

Graphic Output 1x HDMI 2.0

Front Panel I/O Interface USB 3.0 1x Type A USB 2.0 OTG Graphic Output 1 vertical HDMI connector Rear Panel I/O Interface Ethernet 1x GbE POE 8x PoE (15W each, 10/100 Ethernet) USB 3.0 2x Type A Serial Port 2x COM DIO 4x input/ 4x output w/ 1.5KV isolation Storage Device SATA Extention 2.5" SATA SSD. Dimensions: 210 x 170 x 55 (mm)

Yes -20oC – +70oC

DLAP-301-Nano

NVIDIA® Jetson Nano™

Up to 4Gb RAM/16Gb eMMC

Graphic Output 1x HDMI 2.0

Front Panel I/O Interface USB 3.0 1x Type A USB 2.0 OTG Graphic Output 1 vertical HDMI connector Rear Panel I/O Interface Ethernet 1x GbE POE 8x PoE (15W each, 10/100 Ethernet) USB 3.0 2x Type A Serial Port 2x COM DIO 4x input/ 4x output w/ 1.5KV isolation Dimensions: 210 x 170 x 55 (mm)

Yes -20oC – +70oC

ROScube-X

NVIDIA® Jetson AGX Xavier

32Gb RAM/32Gb eMMC on module

Display 1x HDMI 2.0a Front Panel I/O Interface Ethernet 2x GbE (with IEEE 1588 and 802.1AS) USB 3.1 GEN2 1x USB Type A with lockable connector USB 3.1 GEN1 4x USB Type A 1x USB Type A with lockable connector Serial Port COM1: RS-232/485; COM2: RS-232 OTG 1x OTG port for change environment image Side Panel I/O Interface DB-50 connector UART, SPI, CAN, I2C, PWM, ADC with isolation, 20-bit GPIO Audio IN/OUT 1x audio input/output Internal I/O connectors M.2 Extension 1x Socket 2, Key B+M 2280 for Storage (Need NVMe SSD) 1x Socket 1, Key A+E 1630/2230 for Wifi Mini PCIe 1x Mini PCIe socket for LTE USIM 1x USIM socket RTC 2-pin 1.25mm wafer(Optional) Sensor 9-axis sensor

Yes -20oC – +70oC