United Kingdom
Deep learning AIoT
Supplier: ADLINK
Technology type: AIoT
Adlink bring Deep Learning to the edge with a range of NVIDIA based GPGPU heterogeneous compute platforms. These products are based around a range of NVIDIA GPU chips from Jetson to Xavier, along with server and fanless solutions with long life NVIDIA GPGPU’s in both PCIe and MXM expansion.
Range features
A high level overview of what this range offers
- Fanless compact Form Factor
- Integrated GPU
- Flexible performance
- NVIDIA Jetson/Xavier
- Suitable for Inference and Deep Learning
- PoE support for IP cameras
- Wide range of I/O options
- Support Wifi/GSM
- Wide temp range support
- Intel host CPU + MXM GPU
What's in this range?
All the variants in the range and a comparison of what they offer
|
Model |
CPU |
RAM |
Key Features |
Rugged Option |
|---|---|---|---|---|
|
DLAP-3000-CF series |
8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor |
Up to 64GB DDR4 non-ECC memory |
ADLINK MXM Graphics module support (Type A/B, up to 120W) 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) DisplayPort (2 from CPU, 4 from MXM) 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module Reliable Molex type 12V DC-in connector |
No |
|
DLAP-3100-CF series |
8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor |
Up to 64GB DDR4 non-ECC memory |
ADLINK MXM Graphics module support (Type A/B, up to 120W) 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) DisplayPort (2 from CPU, 4 from MXM) 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module Reliable Molex type 12V DC-in connector 1x Intel® i219-LM) and 5x Intel® i210-AT |
No |
|
DLAP-3200-CF series |
8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor |
Up to 64GB DDR4 non-ECC memory |
ADLINK MXM Graphics module support (Type A/B, up to 120W) 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) DisplayPort (2 from CPU, 4 from MXM) 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module Reliable Molex type 12V DC-in connector 1x Intel® i219-LM and 3x Intel® i210-AT 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support |
No |
|
DLAP-4000 Series |
8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
|
Up to 64GB DDR4 non-ECC memory |
NVIDIA® Quadro® PEG card support 8th/9th Gen Intel® Core™ i7/i5/i3 processor Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU) 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module 300W/500W Flex ATX PSU
|
No |
|
DLAP-8000 Series |
9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset
|
Up to 64GB DDR4 / ECC options* |
9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset Dual SODIMMs for up to 64GB DDR4 / ECC options* Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0 Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280 Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM Front accessible I/O and adaptive Function Module v.2 option Flexible and powerful PCIe expansions via backplane
|
No |
|
AVA-5500 series |
6th/7th Gen Intel® Core™ i7 Processors and NVIDIA Quadro® GPU MXM 3.1 Type A/B module on PCI Express x16
|
Up to 32Gb DDR4 |
|
Yes, Class OT1: -25°C to 55°C with P3000 MXM module (supported by condition) Class OT3: -25°C to 70°C with P1000 MXM module |
|
Model |
CPU |
RAM |
Key Features |
Rugged Option |
|---|---|---|---|---|
|
DLAP-211-JNX |
Jetson Xavier™ NX |
Up to 8Gb RAM/16Gb eMMC |
Graphic Output 1 HDMI 2.0 (w. lock) Front Panel I/O Interface Ethernet 2x GbE USB 3.0 4x Type A Audio Mic-in, line-out (Optional) Rear Panel I/O Interface USB 2.0 1x OTG Serial Port 1x COM RS-232 CAN Bus 1 CAN bus (2.0b) Internal I/O Interface Mini PCIe 1x PCIe mini-card slot M.2 M.2 B key 3042 socket USIM 1x USIM slot DIO 4 channel DIO Debug Port 1x debug console, Storage Device SATA Extension M.2 B key support SATA SD Card 1x SD. Dimensions: 148(W)x120(D)x49.1(H)mm |
Yes -20oC – +70oC |
|
DLAP-211-Nano |
NVIDIA® Jetson Nano™ |
Up to 4Gb RAM/16Gb eMMC |
Graphic Output 1 HDMI 2.0 (w. lock) Front Panel I/O Interface Ethernet 2x GbE USB 3.0 4x Type A Rear Panel I/O Interface USB 2.0 1x OTG Serial Port 1x COM RS-232 Internal I/O Interface Mini PCIe 1x PCIe mini-card slot M.2 M.2 B key 3042 socket USIM 1x USIM slot DIO 4 channel DIO Debug Port 1x debug console, Storage Device SATA Extension M.2 B key support SATA SD Card 1x SD. Dimensions: 148(W)x120(D)x49.1(H)mm |
Yes -20oC – +70oC |
|
DLAP-201-JT2 |
NVIDIA® Jetson™ TX2 |
Up to 8Gb RAM/32Gb eMMC |
Graphic Output 1 HDMI 2.0 (w. lock) Front Panel I/O Interface Ethernet 2x GbE USB 3.0 3x Type A Audio Mic-in, line-out (Optional) Rear Panel I/O Interface USB 2.0 1x OTG Serial Port 1x COM CAN Bus 1 CAN bus (2.0b) Internal I/O Interface Mini PCIe 1x PCIe mini-card slot USIM 1x USIM slot DIO 4 channel DIO Debug Port 1x debug console Storage Device SATA Extension mSATA SD Card 1x SD. Dimensions: 148(W)x105(D)x50(H)mm |
Yes -20oC - +70oC |
|
DLAP-301-JNX |
NVIDIA® Jetson Xavier™ NX |
Up to 8Gb RAM/16Gb eMMC |
Graphic Output 1x HDMI 2.0 Front Panel I/O Interface USB 3.0 1x Type A USB 2.0 OTG Graphic Output 1 vertical HDMI connector Rear Panel I/O Interface Ethernet 1x GbE POE 8x PoE (15W each, 10/100 Ethernet) USB 3.0 2x Type A Serial Port 2x COM DIO 4x input/ 4x output w/ 1.5KV isolation Storage Device SATA Extention 2.5" SATA SSD. Dimensions: 210 x 170 x 55 (mm) |
Yes -20oC - +70oC |
|
DLAP-301-Nano |
NVIDIA® Jetson Nano™ |
Up to 4Gb RAM/16Gb eMMC |
Graphic Output 1x HDMI 2.0 Front Panel I/O Interface USB 3.0 1x Type A USB 2.0 OTG Graphic Output 1 vertical HDMI connector Rear Panel I/O Interface Ethernet 1x GbE POE 8x PoE (15W each, 10/100 Ethernet) USB 3.0 2x Type A Serial Port 2x COM DIO 4x input/ 4x output w/ 1.5KV isolation Dimensions: 210 x 170 x 55 (mm) |
Yes -20oC - +70oC |
|
ROScube-X |
NVIDIA® Jetson AGX Xavier |
32Gb RAM/32Gb eMMC on module |
Display 1x HDMI 2.0a Front Panel I/O Interface Ethernet 2x GbE (with IEEE 1588 and 802.1AS) USB 3.1 GEN2 1x USB Type A with lockable connector USB 3.1 GEN1 4x USB Type A 1x USB Type A with lockable connector Serial Port COM1: RS-232/485; COM2: RS-232 OTG 1x OTG port for change environment image Side Panel I/O Interface DB-50 connector UART, SPI, CAN, I2C, PWM, ADC with isolation, 20-bit GPIO Audio IN/OUT 1x audio input/output Internal I/O connectors M.2 Extension 1x Socket 2, Key B+M 2280 for Storage (Need NVMe SSD) 1x Socket 1, Key A+E 1630/2230 for Wifi Mini PCIe 1x Mini PCIe socket for LTE USIM 1x USIM socket RTC 2-pin 1.25mm wafer(Optional) Sensor 9-axis sensor |
Yes -20oC - +70oC |
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