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ADLINK Technology Inc. designs and manufactures products for embedded computing, test & measurement, and automation applications. ADLINK's product line includes computer-on-modules, industrial motherboards, data acquisition modules and complete systems.

The global leader in edge computing

ADLINK Technology Inc. is a global leader in innovative edge technology. Their mission is to affect positive change in society and industry by connecting people, places, and things with AI. Offering robust boards, real-time data acquisition solutions, and application enablement for AIoT, their leading-edge software, hardware, and services have been at the cutting edge of embedded computing for over 25 years.

Serving vertical markets including manufacturing, communications, healthcare, aerospace, defense, energy, infotainment, and transportation. ADLINK is a premier member of the Intel® Internet of Things Solutions Alliance, a partner of NVIDIA, and a contributor to standards initiatives such as Eclipse, OCP, OMG, and ROS2 TSC. They are ISO-9001, ISO-14001, ISO-13485, and TL9000 certified and are publicly traded on TAIEX (Stock Code: 6166).

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GPU and Edge AI solutions


Edge AI Platforms (NVIDIA Quadro based)

Heterogeneous deep learning acceleration platforms for high-performance Edge AI-powered by NVIDIA® Quadro® GPU

ADLINK provides an optimised, highly available computing platform with expandability options, including the MXM cards. Embedded system supporting MXM graphics module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket.

  • DLAP-3000-CF series platforms support performance-hungry workloads (e.g. deep learning) with active cooling for applications requiring very high levels of computing in a limited space.
  • DLAP-4000 Series: Embedded system supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
  • DLAP-8000 Series: 9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation

Edge AI platforms (NVIDIA Jetson based)

Heterogeneous deep learning acceleration boards for high-performance Edge AI-powered by NVIDIA® GPU

ADLINK has developed many edge AI platforms based on the full spectrum of NVIDIA Jetson modules, including NVIDIA® Jetson Nano™, NVIDIA® Jetson™ TX2, and NVIDIA® Jetson AGX Xavier™, and NVIDIA® Jetson Xavier™ NX. Contact us for the latest edge AI offerings.


Edge AI modules

Rugged, fanless AIoT video analytics platform with NVIDIA Quadro® GPU, embedded for real-time video/graphics analytics

ADLINK brings advanced AIoT (AI and IoT) solutions to rail transportation, enabling customers in developing a variety of applications that can deliver true value and performance. ADLINK is committed to helping customers gain competitive advantages by allowing them to focus their development efforts on differentiating their end applications.

ADLINK’s AVA-5500 is being tested and deployed commercially by leading rail system integrators worldwide.

Powered by an Intel® Core™ i7 processor and integrated NVIDIA Quadro MXM module, ADLINK’s EN50155 certified AVA-5500 AIoT Platform is not only ruggedized for both wayside and onboard deployment with its wide range DC input and isolated I/O design but also provides an ideal edge solution for real-time video/graphics analysis applications that are vital to today's increasingly complex railroad operations.

The target applications include but are not limited to:

  •  Passenger information systems
  •  Railroad intrusion detection
  •  Train station surveillance
  •  Onboard video security
  •  Railroad hazard detection



COM Express

Basic, compact and mini-sized modules

The most commonly used COM Express pinouts today are Type 6, Type 7 and Type 10.

Type 6
COM Express basic/compact size is the most popular and widely used computer-on-module form factor on the market. With pinouts closely matching the feature set of common x86 based silicon, two COM Express connectors allow for designs of up to 75 watts. The Type 6 pinout has a strong focus on multiple modern display outputs targeting applications such as medical, gaming, test and measurement and industrial automation.

Type 7

This basic/compact size is optimised for high performance, high bandwidth headless applications. one of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances.  Applications for Type 7 modules are very broad: general-purpose rugged embedded computer, mission-critical server, SDN appliance, signal processing & data acquisition appliance, network test equipment, satellite gateway, in-flight entertainment system.


Type 10

The COM Express mini size Type 10 module is intended for low power platforms (TDP 12W and below), such as handheld devices (smart battery) for industrial, medical, transportation, and controllers for outdoor applications. The COM Express Type 10 Mini (84 x 55 mm, credit card size) is capable of entry-level processing with ultra-low power consumption while supporting graphics and optimised I/O count for mobile applications.




2.0 and 2.1 compliant modules

SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high-speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low-level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smartphones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.

The module power envelope is typically under 6W and the form factor is ideal for applications that mandate designs able to withstand extreme environmental conditions.

  • LEC-IMX8MP (Preliminary) - SMARC short size module with NXP i.MX 8M plus
  • LEC-iMX8M - Preliminary SMARC short size module with NXP i.MX 8M
  • LEC-PX30 - SMARC short size module with Rockchip PX30 Quad-Core ARM Cortex A35
  • LEC-AL - SMARC® short size module with Intel Atom® E3900 series, Pentium™ N4200 or Celeron™ N3350 processor (codename: Apollo Lake)


 A new PICMG computer-on-module for high-performance edge computing

The PCI Industrial Computer Manufacturers Group (PICMG) is now entering the final stages in the development of the new COM-HPC computer-on-module specification that will address the needs of the very high end of industrial edge computing market. The COM-HPC specification is intended to extend on the success of COM Express, not to replace it, and was officially released in Q1 of 2021.

ADLINK’s proof-of-concept COM-HPC module has a server type feature set, is Size E (160mm x 200mm) and provides up to 16 computing cores in a 110W platform with 8 DIMMs. A heat spreader is mounted on top of the module to extract heat to an external cooling device.

Industrial fanless PC's


High performance and compact expandable fanless embedded PC's

Industrial fanless embedded PCs

The Matrix series of expandable fanless embedded computers are designed to enhance the responsiveness and durability of edge AI and edge computing applications. Designed to perform and to last, the Matrix expandable fanless embedded computers offer performance, expandability, easy integration, and ruggedness to enable timely data-driven decision making at the edge.

The Matrix expandable fanless embedded computers deliver efficiency, productivity and security enhancement across industries by accelerating compute-intensive high-resolution medical imaging for faster diagnosis, detecting and classifying product defects for quality assurance, deploying facial recognition at entry points for secure access control, tracking the movement of workers for hazard prevention and control, and more.

The Matrix IoT gateways are used for remote monitoring and control to avoid unnecessary shutdown for oyster farms, minimise vehicle downtime for truck fleets and optimise charging of electric cars.


Smart cameras


AI machine vision devices

ADLINK AI PnP machine vision solutions can evolve your existing applications to AI-enablement right away with no need to replace existing hardware. Unique alliances with leading AI brands allow ADLINK access to valuable native support, supporting the most advanced technology, shortest time to market, and maximum reliability.

  • NEON-1000-MDX Series - Intel Atom® E3930 and Movidius™ Myriad™ X-based industrial AI smart camera for AI Vision at the Edge
  • NEON-2000-JNX Series- NVIDIA® Jetson Xavier™ NX-based industrial AI smart camera for the edge
  • NEON-2000-JT2-X Series - NVIDIA® Jetson™ TX2-based IP67-certified AI smart camera

Panel PC's and monitors


Smart panel

The ADLINK smart panel is an embedded open frame panel computer able to integrate into a wide variety of form factors and configurations. The smart panel provides an exceptional range of available display sizes, touch-types, DC inputs, and I/O, able to fulfil a diversity of vertical requirements. Function modules can expand I/O irrespective of type or quantity.

  • SP-KL series - Intel® Core™ processor-based fanless 7”/10.1”/12.1”/15.6”/18.5”/21.5” panel computer
  • SP-AL series - Intel Atom® processor-based fanless 7”/10.1”/12.1”/15.6”/18.5”/21.5” panel computer

Rugged systems

From small low power modules and rugged form factor types, through to cloud server platforms.

Intended for embedded systems that meet extremely harsh environments of military applications where size, weight, and power (SWaP) are critical, ADLINK's portfolio of commercial off-the-shelf (COTS) products enable fast deployment, with reduced development time and cost compared to proprietary systems. 

These products are Extreme Rugged™ and suitable for mission-critical signal intelligence; radar; and Intelligence, Surveillance and Reconnaissance (ISR) applications in the most demanding environments.


The Embedded Computing Technology Centre drives advanced solutions, so you can deliver the technologies of tomorrow - today.


Design customer driven systems, build prototypes and manufacture products to meet your distinct needs. Many of the platform-based technologies that we offer were designed with customisation in mind.

Our capabilities help us to offer solutions across all stages of your project. Whether your requirements are standard, modified or highly customised, our experts support and identify your aims and work to ensure that we provide a solution that fits.

Technical news and insights

Access industry news and Acal BFi articles, white papers and brochures

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Our approach

When it comes to developing custom solutions for tomorrow's technologies, we trust our approach to deliver the best possible outcome.

Our engineers will skilfully guide you through each stage of your project, working with you to understand and identify a solution that meets your technical and commercial needs before designing and integrating your solution.



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Working together to create the right solution.



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From modified to fully customised components.



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Technological expertise across your application lifecycle.