United Kingdom
Fanless Embedded Computer (Matrix)
Supplier: ADLINK
Technology type: Fanless IPC
The Adlink Matrix family of embedded industrial computers offer ultra-reliable, flexible platforms backed with Intel® long life cycle CPU’s. They offer both compact (MXE) and expandable (MXC) versions along with their cost effective value (MVP) range.
Adlink has created a highly configurable offering covering high performance (with the addition of GPU add in cards) and low power applications. HALT (Highly Accelerated Life Testing) certifies these platforms to ensure reliability in demanding applications.
Range features
A high level overview of what this range offers
- Low (Atom) to high (Xeon) CPU options
- GPU accelerator add in capable (MXM + PCIe)
- Fanless & cableless design for high reliability
- Wide range of I/O options
- RAID support
- Multiple PCI and PCIe expansion options
- Adlink SEMA (Smart Embedded Monitoring Agent) support
- Tested to work in wide temperature and harsh/dusty environments applications
- Industry leading MTBF
- Ideal for Edge and AI
What's in this range?
All the variants in the range and a comparison of what they offer
|
Model |
CPU |
RAM |
I/O |
Rugged option |
|---|---|---|---|---|
|
MXC-6600 series |
9/8th Gen Intel Xeon – Core I series |
Up to 32Gb RAM |
2/4 PCie slots, USB 3.1, RAID, M.2 2 x USIM, 2 x Gbe, 6 x COM,TPM 2.0, HDMI, 2x DP++, 8 ch DI/DO, WiFi/BT/3G/4G LTE/LoRa kits available |
Yes -20 - +70 oC. |
|
MXC-6400 series |
6th Gen Intel Core I series |
Up to 32Gb RAM |
1 x PCI/2 x PCIe slots, 6 x USB3.0, 2 x miniPCIe, 1 x USIM, 3 x Gbe, TPM 1.2, 2 x 2.5” H/S SATA III, WiFi/BT/3G/4G LTE/LoRa kits available. |
Yes -20 - +70 oC. |
|
MVP-6100 |
9/8th Gen Intel Xeon/Core I Series |
Up to 32Gb RAM |
1/3 x PCI/PCIe slots, 2 x 2.5” SATA III SSD/HDD/M.2, 2x DP++,DVi,VGA,3x Gbe,3x COM,TPM 2.0, USB 3.1 Gen 1/2, USB 2.0, WiFi/BT/3G/4G LTE/LoRa kits available. |
Yes -20 - +60oC |
|
MVP-6100-MXM |
9/8th Gen Intel Xeon/Core I Series |
Up to 32Gb RAM |
1/3 x PCI/PCIe slots, MXM GPGPU expansion, 2 x 2.5” SATA III SSD/HDD/M.2, 2x DP++,DVi,VGA,3x Gbe,3x COM,TPM 2.0, USB 3.1 Gen 1/2, USB 2.0, WiFi/BT/3G/4G LTE/LoRa kits available. |
Yes -20 - +60oC |
|
Model |
CPU |
RAM |
I/O |
Rugged option |
|---|---|---|---|---|
|
MXE-5600 series |
9th Gen Intel Xeon/Core I series |
Up to 32Gb ECC/Non ECC |
2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.02x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0 Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280 Embedded expansion: Mini PCIe, M.2 3042, 2x USIM Front accessible I/O and adaptive function module v.2 Optional Wi-Fi, BT, 3G, 4G LTE, LoRa wireless kit (w/ antenna) |
Yes -20oC – +70oC |
|
MXE-1500 series |
Intel Celeron N3160/N3060 SoC |
Up to 8Gb |
3x independent displays: DP, VGA (optional LVDS or DP) Built-in ADLINK SEMA management solution 3x GbE, 2x RS-232/422/485, 2x RS-232, 4x DI/ 4x DO Optional: extra 2x RS-232/422/485, TPM2.0, amplifier 2x USB 3.0, 5x USB 2.0, 1x 2.5" SATA, CFast, Mini PCIe, I2C Last generation to support Windows 7 OS |
Yes -20oC – +70oC |
|
MVP-5100-MXM series |
9/8th Gen Intel Core I series |
Up to 32Gb |
Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0 3x USB 3.1 Gen 1, 3x USB 2.0 Storage options: 2x 2.5" SATA, M.2 2280 Front accessible I/O and adaptive function module 2.0 options Mini PCIe, M.2 3042, 2x USIM World leading embedded GP/GPU computing options built-in |
Yes -20oC - +60oC |
|
MVP-5100 series |
9/8th Gen Intel Core I series |
Up to 32Gb |
Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/ TPM2.0 2x USB3.1 Gen2 + 1x USB3.1 Gen1 + 3x USB2.0 Rich storage:2x 2.5" SATA, CFast, M.2 2280 Embedded Expansion: Mini PCIe/ M.2 3042/ 2x USIM Front accessible I/O and adaptive function module v.2 option
|
Yes -20oC - +60oC |
|
MXE-200 series |
Intel Atom E3900 series |
Up to 8Gb |
Compact fanless design: 140(W) x 110(D) x 58(H) mm 1x DisplayPort, 2x USB 2.0, 2x USB 3.0, 2x GbE ports, 2x COM ports (RS-232/422/485) 2x mPCIe slots, 1x USIM slot, 1 x mSATA, 1x Micro SD slot 1 x 2.5 " SATA SSD by storage kit or isolated 8x DI/ 8x DO (Optional) eSIM support (by project) (optional) Built-in ADLINK SEMA management solution
|
Yes -40 - +85oC |
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