SL8092 3G-HSPA+ SMD Module with GPS for EMEA

Manufacturer's part number :

AirPrime SL8092

Manufacturer Sierra Wireless

Sierra Wireless

Description :

SL8092 is a 3G HSPA+ Dual band module with an integrated GPS receiver primarily for EMEA. Fall back to 2G GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G 900/2100 and 2G 850/900/1800/1900. Form factor: 25x30 mm, SMD LGA package.

AirPrime® SL Series come in standard LGA packages for cost-effective, fully-automated high-volume production. Ensure easy upgrade paths to next-generation network technologies with a wide selection of air interfaces. Accelerate your M2M development and deployment with its application framework and cloud-based device management services.



  • Quote and availability


  • Air interface: 3G HSPA+ with Rx Diversity, 2G GSM/GPRS/EDGE, GPS
  • 3G bands: 900/2100 MHz
  • 2G bands: 850/900/1800/1900 MHz
  • Peak data rate: DL 14.4 Mbps, UL 5.76 Mbps
  • GPS: Qualcomm
  • Form factor: SMD LGA package, 25x30x2.35mm
  • Supply Voltage: 3.6V nominal
  • Operating Temperature: -40°C to +85°C

  • Control, software and features

  • Control options: AT Commands
  • Drivers: Android, Linux, Windows
  • Internet services: TCP, UDP

  • Interfaces

  • UART: 1x 4 wire or 1x 8 wire
  • USB: 1x 2.0 High Speed
  • SPI: 1x 4 wire
  • GPIO: up to 3
  • Flash LED output
  • PWM (Buzzer)
  • Tx Burst indicator
  • SIM interface: 1.8/3V

  • Audio

  • Digital audio: PCM
  • Codec: FR, EFR, HR, AMR
  • Quality: VDA2A
  • Echo cancellation
  • Noise reduction
  • DTMF
  • Benefits

  • Compact and cost-effective module with processing capabilities
  • High scalability for new network technologies
  • A single form-factor compatible for multiple regions
  • Resists industrial environments and extended temperatures
  • Fast deployment with an embedded application framework
  • Easy upgrade path to new network technologies
  • Firmware/feature compatible with the AirPrime MC879x MiniCard module
  • Supports efficient and reliable high volume production requirements
  • Manufacturing technology excellence
  • Efficient ground pads heat dissipation
  • Supports industrial requirements with extended temperature
  • Standard 25x30mm LGA form factor
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