Intel® Core™ i3-6100E Fanless Embedded Computer

Manufacturer's part number :


Manufacturer Adlink


Description :

ADLINK is pleased to announce its new MXC-6403D of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i3-6100E processor (codename Skylake) and the QM170 chipset. Featuring leading performance, high storage density from 4x 2.5 inches SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6403D Series fully meets the needs of intelligent transportation systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.

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  • 6th generation Intel® Core™ i7-6820EQ processor (codename Skylake) with QM170 chipset
  • Dual-channel DDR4 2133MHz SO-DIMM sockets accept up to 32GB of memory
  • Support for up to 3 independent displays, accelerated HW media codecs enabling Ultra HD 4K
  • PCI and 2 PCIe Gen3 x8 (or 1 PCIe Gen3 x16) slots
  • World-class MTBF withstanding up to 5Grm vibration and 50G shock
  • Superior -20°C to 60 (70)°C operating temperature range
  • Front-mounted I/O includes 2x DisplayPort + DVI-I, 3x GbE, 4x COM, 6x USB 3.0, and 16x isolated DI/O
  • 2x 2.5 inch hot-swappable SATA drive bays
  • Remote management from preloaded SEMA 3.0 w/ Cloud Access
  • 4x 2.5 inch SATA III installation capability with RAID 0/1/5/10 support, via 2 hot-swappable 2.5 inch SATA III trays, 2 internal 2.5 inch SATA III ports, and 1 CFast socket
  • Benefits

  • Ruggedness & Reliability
  • Easy Maintenance
  • High Storage Density
Features Similar products
Processor Type Intel® Core™ i7/i5/i3  

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Expansion PCI, PCIe  
Fanless Yes  
Ruggedised Option Yes  
Extended Temp Option Yes