COM Express® Module, Type 6, Intel Xeon E3-1278L, 2.0/3.3GHz, GT3 level graphics
Manufacturer's part number :
The Express-BL-E3-1278 is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ Xeon® processors (codename "Broadwell-H”) with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. The Express-BL features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3L non-ECC dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM87 Chipset. Integrated Intel® Generation 8 Graphics includes features such as OpenGL 4.0, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-BL has dual stacked SODIMM sockets for up to 32GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
The ADLINK Express-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
View our wide range of Computer-on-Module
View our portfolio of Embedded computing
See all products from our supplier Adlink
Technical Data :
Quote and availability
Ask our experts
- 5th Generation Intel® Xeon® Processor with Intel® QM87 Express Chipset
- Up to 32GB Dual Channel DDR3L at 1600MHz
- Three DDI channels, one LVDS and VGA, support up to 3 independent displays
- Seven PCIe x1, one PCIe x16
- GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C (optional)