Deep learning AIoT
Adlink apporte l’apprentissage profond à la périphérie avec une gamme de plateformes de calcul hétérogènes GPGPU basées sur NVIDIA. Ces produits s’appuient sur une gamme de puces GPU NVIDIA, de Jetson à Xavier, ainsi que sur des solutions serveur et sans ventilateur avec des GPGPU NVIDIA de longue durée dans les extensions PCIe et MXM.
Caractéristiques de la gamme
Un aperçu de haut niveau de ce que cette gamme offre
- Facteur de forme compact sans ventilateur
- GPU intégré
- Performances flexibles
- NVIDIA Jetson/Xavier
- Adapté pour l’inférence et l’apprentissage profond
- Prise en charge PoE pour les caméras IP
- Large gamme d’options d’E/S
- Prise en charge du Wifi/GSM
- Prise en charge d’une large plage de températures
- CPU Intel hôte + GPU MXM
Que trouve-t-on dans cette gamme ?
Toutes les variantes de la gamme et une comparaison de ce qu’elles offrent
| Model | CPU | RAM | Key Features | Rugged Option |
|---|---|---|---|---|
DLAP-3000-CFseries | 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor | Up to 64GB DDR4 non-ECC memory | ADLINK MXM Graphics module support (Type A/B, up to 120W) 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) DisplayPort (2 from CPU, 4 from MXM) 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module Reliable Molex type 12V DC-in connector | No |
DLAP-3100-CF series | 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor | Up to 64GB DDR4 non-ECC memory | ADLINK MXM Graphics module support (Type A/B, up to 120W) 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) DisplayPort (2 from CPU, 4 from MXM) 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module Reliable Molex type 12V DC-in connector 1x Intel® i219-LM) and 5x Intel® i210-AT | No |
DLAP-3200-CF series | 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor | Up to 64GB DDR4 non-ECC memory | ADLINK MXM Graphics module support (Type A/B, up to 120W) 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) DisplayPort (2 from CPU, 4 from MXM) 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module Reliable Molex type 12V DC-in connector 1x Intel® i219-LM and 3x Intel® i210-AT 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support | No |
DLAP-4000 Series | 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor | Up to 64GB DDR4 non-ECC memory | NVIDIA® Quadro® PEG card support 8th/9th Gen Intel® Core™ i7/i5/i3 processor Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU) 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module 300W/500W Flex ATX PSU | No |
DLAP-8000 Series | 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset | Up to 64GB DDR4 / ECC options* | 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset Dual SODIMMs for up to 64GB DDR4 / ECC options* Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0 Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280 Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM Front accessible I/O and adaptive Function Module v.2 option Flexible and powerful PCIe expansions via backplane | No |
AVA-5500 series | 6th/7th Gen Intel® Core™ i7 Processors and NVIDIA Quadro® GPU MXM 3.1 Type A/B module on PCI Express x16 | Up to 32Gb DDR4 |
| Yes,Class OT1: -25°C to 55°C with P3000 MXM module (supported by condition) Class OT3: -25°C to 70°C with P1000 MXM module |
| Model | CPU | RAM | Key Features | Rugged Option |
|---|---|---|---|---|
DLAP-211-JNX | Jetson Xavier™ NX | Up to 8Gb RAM/16Gb eMMC | Graphic Output 1 HDMI 2.0 (w. lock) Front Panel I/O Interface Ethernet 2x GbE USB 3.0 4x Type A Audio Mic-in, line-out (Optional) Rear Panel I/O Interface USB 2.0 1x OTG Serial Port 1x COM RS-232 CAN Bus 1 CAN bus (2.0b) Internal I/O Interface Mini PCIe 1x PCIe mini-card slot M.2 M.2 B key 3042 socket USIM 1x USIM slot DIO 4 channel DIO Debug Port 1x debug console, Storage Device SATA Extension M.2 B key support SATA SD Card 1x SD. Dimensions:148(W)x120(D)x49.1(H)mm | Yes -20oC – +70oC |
DLAP-211-Nano | NVIDIA® Jetson Nano™ | Up to 4Gb RAM/16Gb eMMC | Graphic Output 1 HDMI 2.0 (w. lock) Front Panel I/O Interface Ethernet 2x GbE USB 3.0 4x Type A Rear Panel I/O Interface USB 2.0 1x OTG Serial Port 1x COM RS-232 Internal I/O Interface Mini PCIe 1x PCIe mini-card slot M.2 M.2 B key 3042 socket USIM 1x USIM slot DIO 4 channel DIO Debug Port 1x debug console, Storage Device SATA Extension M.2 B key support SATA SD Card 1x SD. Dimensions:148(W)x120(D)x49.1(H)mm | Yes -20oC – +70oC |
DLAP-201-JT2 | NVIDIA® Jetson™ TX2 | Up to 8Gb RAM/32Gb eMMC | Graphic Output 1 HDMI 2.0 (w. lock) Front Panel I/O Interface Ethernet 2x GbE USB 3.0 3x Type A Audio Mic-in, line-out (Optional) Rear Panel I/O Interface USB 2.0 1x OTG Serial Port 1x COM CAN Bus 1 CAN bus (2.0b) Internal I/O Interface Mini PCIe 1x PCIe mini-card slot USIM 1x USIM slot DIO 4 channel DIO Debug Port 1x debug console Storage Device SATA Extension mSATA SD Card 1x SD. Dimensions:148(W)x105(D)x50(H)mm | Yes -20oC – +70oC |
DLAP-301-JNX | NVIDIA® Jetson Xavier™ NX | Up to 8Gb RAM/16Gb eMMC | Graphic Output 1x HDMI 2.0 Front Panel I/O Interface USB 3.0 1x Type A USB 2.0 OTG Graphic Output 1 vertical HDMI connector Rear Panel I/O Interface Ethernet 1x GbE POE 8x PoE (15W each, 10/100 Ethernet) USB 3.0 2x Type A Serial Port 2x COM DIO 4x input/ 4x output w/ 1.5KV isolation Storage Device SATA Extention 2.5" SATA SSD. Dimensions: 210 x 170 x 55 (mm) | Yes -20oC – +70oC |
DLAP-301-Nano | NVIDIA® Jetson Nano™ | Up to 4Gb RAM/16Gb eMMC | Graphic Output 1x HDMI 2.0 Front Panel I/O Interface USB 3.0 1x Type A USB 2.0 OTG Graphic Output 1 vertical HDMI connector Rear Panel I/O Interface Ethernet 1x GbE POE 8x PoE (15W each, 10/100 Ethernet) USB 3.0 2x Type A Serial Port 2x COM DIO 4x input/ 4x output w/ 1.5KV isolation Dimensions: 210 x 170 x 55 (mm) | Yes -20oC – +70oC |
ROScube-X | NVIDIA® Jetson AGX Xavier | 32Gb RAM/32Gb eMMC on module | Display 1x HDMI 2.0a Front Panel I/O Interface Ethernet 2x GbE (with IEEE 1588 and 802.1AS) USB 3.1 GEN2 1x USB Type A with lockable connector USB 3.1 GEN1 4x USB Type A 1x USB Type A with lockable connector Serial Port COM1: RS-232/485; COM2: RS-232 OTG 1x OTG port for change environment image Side Panel I/O Interface DB-50 connector UART, SPI, CAN, I2C, PWM, ADC with isolation, 20-bit GPIO Audio IN/OUT 1x audio input/output Internal I/O connectors M.2 Extension 1x Socket 2, Key B+M 2280 for Storage (Need NVMe SSD) 1x Socket 1, Key A+E 1630/2230 for Wifi Mini PCIe 1x Mini PCIe socket for LTE USIM 1x USIM socket RTC 2-pin 1.25mm wafer(Optional) Sensor 9-axis sensor | Yes -20oC – +70oC |
