Embedded device server, xPico Wi-Fi W1002, IEEE 802.11 b/g/n, extended temperature, SMT, bulk, RoHS

Numéro de référence fabricant :

xPico Wi-Fi SMT U.FL

Fabricant Lantronix


Description :

See how we solve customer design challenges with our technical expertise and the latest technology

Reduce your development costs, shorten your time to market, and leverage mobile solutions with the Lantronix® xPico® Wi-Fi® family of embedded device servers. Based on the Broadcom® WICED™ Platform, it is one of the world's smallest and most flexible Wi-Fi® device servers. xPico Wi-Fi is a state-of-the-art member of the xPico family, providing low power, Soft AP and simultaneous client mode, full IP and WLAN stacks. The xPico Wi-Fi module is a complete device server suitable for mobile M2M applications and includes industry best 5-year warranty.

Tablet and Smartphone Enable Your Devices: Access your data and devices from anywhere - wired or wireless. Lantronix industry-proven device server application and protocol stacks enables seamless remote access to device data, simplifying design integration, all while providing robust connectivity - including the ability to access data from any mobile device, including smartphones and tablets.

Robust Networking Solution: The Lantronix xPico Wi-Fi Module is an extremely compact, low power networking solution that enables wireless LAN connectivity on virtually any solution with a SPI, USB (device) or serial interface.

Simultaneous Access Point and Client Mode: The xPico Wi-Fi module is a state-of-the-art solution that offers all the functions one can expect including a unique simultaneous Soft AP and Client mode. This allows for easy points of access while maintaining a secure network connection.

Flexibility: xPico Wi-Fi modules have a chip-sized footprint with 2 mounting options (40-pin Board-to-Board SMT Connector and direct SMT), providing unmatched flexibility for you to choose the right network device for your application.

Cost Savings and Faster Time-To-Market: As one of the smallest embedded device servers in the world, the xPico Wi-Fi module can be utilized in designs typically intended for chip solutions, befitting in advantages to cost and time-to-market. Its "zero host load" eliminates any need for drivers on the connected microcontroller making implementation easy and fast with virtually no need to write a single line of code. This translates to considerably lower development costs and faster time-to-market. As xPico Wi-Fi meets FCC Class B, UL and EN EMC and safety compliance, your development time is shortened. The xPico Wi-Fi module can reduce the overall cost of ownership compared to the competition.

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  • Wireless lan interface
  • Ieee 802.11 b/g and ieee 802.11n (single stream) wlan interface (2.4 ghz only)
  • Ieee 802.11 d/h/i/j/k/w/r
  • On module antenna (xpcw1003100b)
  • U.Fl connector for external antenna (xpc100100b-01 and xpcw1002100b)
  • Serial interface
  • Two serial cmos ports (3.3v, 5v tolerant)
  • 300 to 921.6 kbps
  • Flow control xon/xoff, rts/cts (sport 1 only)
  • Lantronix tunneling application
  • Host interface
  • Dual serial port, spi, usb 2.0* (device)
  • 8 gpio
  • Network protocols
  • Tcp/ip, udp/ip, dhcp, arp, icmp, dhcp, auto-ip, dns
  • Networking capabilities
  • Soft access point with dhcp server
  • Quickconnect: dynamic profiles facilitate easy and rapid connections to access points
  • Management and control
  • Web server - landing page
  • Cli (serial monitor port)
  • Xml import and export (xcr)
  • Field upgradable firmware (ota)
  • Security
  • Ieee 802.11i support - wpa-personal, wpa2-personal
  • 256-bit aes encryption*
  • Architecture
  • Arm cortex m3 class processor with on-chip flash and sram
  • 1mb flash and 128 kb sram
  • 1mb spi flash storage
  • Power
  • Input voltage: 3.3vdc
  • Low power consumption of approximately 6μa standby
  • Physical interface
  • 40-pin board-to-board smt connector (xpw100100b-01)
  • 56-pad smt castellation (xpcw1002100b and xpcw1003100b)
  • Environmental
  • Operating temp: -40° to +85° c
  • Xpw100100b-01: for operation over +70° c a thermal pad is required
  • Storage temp: -40° to +85° c
  • Relative humidity: 0% to 90% non-condensing
  • Certifications
  • Fcc class b, ul and en emc, japan, au/nz
  • Packaging
  • Dimensions:
  • Xpw100100b-01: 24mm (l) x 16.5mm (w) x 5.64mm (h)
  • Xpcw1002100b: 26.1mm (l) x 18.3mm (w) x 3.0 mm (h)
  • Xpcw1003100b: 30.1mm (l) x 18.3mm (w) x 3.0 mm (h)
  • Weight: 2.5g
  • Warranty
  • 5-year limited
Caractéristiques Produits similaires
Form factor / Connector / Mounting option Module / SMT  

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