High Speed, Parallel Board-to-Board Connector, Ball-Grid Array Termination

Manufacturer's part number :


Manufacturer Hirose


Description :

Configuration: Transmission unit; Board to board distance:22.2mm NOTE: The HIROSE product information on this website is for reference only. Please request the Engineering Drawing for the most current and accurate design information from your local Acal BFI sales office.

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Technical Data :

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  • High speed transmission. Differential impedance:100 ohm +/-10% (Tr.100ps)
  • Hirose unique dual contact structure assures highly reliable performance.
  • Hirose unique 3-piece engagement structure realizes floating mechanism.
  • 75N max. of insertion force is achieved in spite of multipin of 380-pos. by Hirose unique contact structure.
  • Stacking height from 15mm to 50mm are available by changing transmission boards.
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Connector Type Male  
Number of Positions 380  
Number of Rows 20  
Termination Surface mount  
PCB Mounting Orientation Vertical  
Stack Height (mm) 22.2  
Centreline (mm) 1  
Pitch (mm) 1.0  
Orientation Parallel