Embedded device server, xPico Wi-Fi W1002, IEEE 802.11 b/g/n, extended temperature, SMT, bulk, RoHS

Manfacturer's part number :

xPico Wi-Fi SMT U.FL

Produttore Lantronix


Descrizione :

Reduce your development costs, shorten your time to market, and leverage mobile solutions with the Lantronix® xPico® Wi-Fi® family of embedded device servers. Based on the Broadcom® WICED™ Platform, it is one of the world's smallest and most flexible Wi-Fi® device servers. xPico Wi-Fi is a state-of-the-art member of the xPico family, providing low power, Soft AP and simultaneous client mode, full IP and WLAN stacks. The xPico Wi-Fi module is a complete device server suitable for mobile M2M applications and includes industry best 5-year warranty.

Tablet and Smartphone Enable Your Devices: Access your data and devices from anywhere - wired or wireless. Lantronix industry-proven device server application and protocol stacks enables seamless remote access to device data, simplifying design integration, all while providing robust connectivity - including the ability to access data from any mobile device, including smartphones and tablets.

Robust Networking Solution: The Lantronix xPico Wi-Fi Module is an extremely compact, low power networking solution that enables wireless LAN connectivity on virtually any solution with a SPI, USB (device) or serial interface.

Simultaneous Access Point and Client Mode: The xPico Wi-Fi module is a state-of-the-art solution that offers all the functions one can expect including a unique simultaneous Soft AP and Client mode. This allows for easy points of access while maintaining a secure network connection.

Flexibility: xPico Wi-Fi modules have a chip-sized footprint with 2 mounting options (40-pin Board-to-Board SMT Connector and direct SMT), providing unmatched flexibility for you to choose the right network device for your application.

Cost Savings and Faster Time-To-Market: As one of the smallest embedded device servers in the world, the xPico Wi-Fi module can be utilized in designs typically intended for chip solutions, befitting in advantages to cost and time-to-market. Its "zero host load" eliminates any need for drivers on the connected microcontroller making implementation easy and fast with virtually no need to write a single line of code. This translates to considerably lower development costs and faster time-to-market. As xPico Wi-Fi meets FCC Class B, UL and EN EMC and safety compliance, your development time is shortened. The xPico Wi-Fi module can reduce the overall cost of ownership compared to the competition.

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  • Wireless lan interface
  • Ieee 802.11 b/g and ieee 802.11n (single stream) wlan interface (2.4 ghz only)
  • Ieee 802.11 d/h/i/j/k/w/r
  • On module antenna (xpcw1003100b)
  • U.Fl connector for external antenna (xpc100100b-01 and xpcw1002100b)
  • Serial interface
  • Two serial cmos ports (3.3v, 5v tolerant)
  • 300 to 921.6 kbps
  • Flow control xon/xoff, rts/cts (sport 1 only)
  • Lantronix tunneling application
  • Host interface
  • Dual serial port, spi, usb 2.0* (device)
  • 8 gpio
  • Network protocols
  • Tcp/ip, udp/ip, dhcp, arp, icmp, dhcp, auto-ip, dns
  • Networking capabilities
  • Soft access point with dhcp server
  • Quickconnect: dynamic profiles facilitate easy and rapid connections to access points
  • Management and control
  • Web server - landing page
  • Cli (serial monitor port)
  • Xml import and export (xcr)
  • Field upgradable firmware (ota)
  • Security
  • Ieee 802.11i support - wpa-personal, wpa2-personal
  • 256-bit aes encryption*
  • Architecture
  • Arm cortex m3 class processor with on-chip flash and sram
  • 1mb flash and 128 kb sram
  • 1mb spi flash storage
  • Power
  • Input voltage: 3.3vdc
  • Low power consumption of approximately 6μa standby
  • Physical interface
  • 40-pin board-to-board smt connector (xpw100100b-01)
  • 56-pad smt castellation (xpcw1002100b and xpcw1003100b)
  • Environmental
  • Operating temp: -40° to +85° c
  • Xpw100100b-01: for operation over +70° c a thermal pad is required
  • Storage temp: -40° to +85° c
  • Relative humidity: 0% to 90% non-condensing
  • Certifications
  • Fcc class b, ul and en emc, japan, au/nz
  • Packaging
  • Dimensions:
  • Xpw100100b-01: 24mm (l) x 16.5mm (w) x 5.64mm (h)
  • Xpcw1002100b: 26.1mm (l) x 18.3mm (w) x 3.0 mm (h)
  • Xpcw1003100b: 30.1mm (l) x 18.3mm (w) x 3.0 mm (h)
  • Weight: 2.5g
  • Warranty
  • 5-year limited
Caratteristiche Prodotti simili
Form factor / Connector / Mounting option Module / SMT  

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