CSP / BGA Burn-In Socket

Manufacturer's part number :


Manufacturer Wells CTI


Description :

The 775C4186-XXX from Sensata is an Open Top burn-in/test socket for CSP / BGA packages on 0.5 mm pin pitch

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  • 0.5mm and 0.8mm pitch
  • Compression surface mount
  • High performance/low cost achieved through use of carrier loaded stamped contact
  • Z-axis compliant buckling beam contact supports any type solder ball shape and composition
  • Compact outline and low actuation force achieved through use of innovative latching mechanism
Features Similar products
Temperature Range 150 °C  

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Package Type CSP / BGA  
Pitch (mm) 0.5  
Number of Positions 186  
Package Size (mm) 6 x 9  
Socket Style Open Top  
Termination Style Surface mount